International Business Machines Corporation

Daniel S Jubin

Bert Jan Offrein

Roger F Dangel

Antonio La Porta

Norbert M Meier

Edward William Kiewra

Jens Hofrichter

Jonas R Weiss

Tobias Lamprecht

Folkert Horst

Valeria Bragaglia

An electrical memristive device has a layer structure. The layer structure comprises two electrodes and a bilayer material arrangement that connects the two electrodes. The bilayer material arrangement may, for example, be sandwiched by the two electrodes, in direct contact therewith. The bilayer material arrangement includes an HfOlayer, where 1.3±0.1≤y<1.9±0.1, as well as a WOlayer in direct contact with the HfOlayer, where 2.5±0.1≤x<2.9±0.1. The bilayer arrangement involves sub-stoichiometric layers of HfOand WO, where the WOlayer may advantageously have a polycrystalline structure in the monoclinic phase, while the HfOlayer is preferably amorphous.

Electrical memristive devices based on bilayer arrangements of HfOand WO

The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.

Wafer prober for testing in-wafer photonic integrated circuits

A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Passive alignment of polymer waveguides

A device for propagating light is described, comprising: a substrate having a semiconductor material, an insulating layer, wherein the insulating layer is arranged on the substrate, a recess reaching through the insulating layer and into the substrate, wherein the recess is at least partially filled with a filler material, and a waveguide arranged in or on the filler material.

Device for propagating light and method for fabricating a device

A method of forming a device for propagating light includes providing a substrate having a semiconductor material; placing an insulating layer on the substrate; providing a recess reaching through the insulating layer and into the substrate; filling the recess at least partially with a filler material; and arranging a waveguide in or on the filler material.

Method for fabricating a device for propagating light

A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Method and spacer for assembling flexible optical waveguide ribbons, and assembled stack of such ribbons

Embodiments include methods for connecting a stack of waveguide layers to a face of a ferrule presenting a mechanical alignment structure. The method includes bringing a ferrule in an alignment position and dispersing glue in cavities of mechanical alignment structure for each waveguide layer. The method also includes sliding the waveguide layer into the cavities, inserting a comb-like tool in the ferrule so that the tool presses the waveguide layer into the cavities, glue curing the ferrule, and adding a cover to the ferrule. The mechanical alignment structure comprises mechanical alignment slots arranged in a bidirectional lattice structure.

Ferrule of multilayer waveguide connector

A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.

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Langnau am Albis, Switzerland

Daniel S Jubin