Motorola Corporation

Dmr International, Inc.

Motorola Solutions, Inc.

University of Michigan

Motorola Mobility LLC

Daniel Roman Gamota

Jie Zhang

Marc Kenneth Chason

Krishna Kalyanasundaram

Paul W Brazis, Jr

John Szczech

Steven Michael Scheifers

Jerzy Wielgus

Rick Latella

Steven Lewis Wille

Andrew Frederick Skipor

Paul Brazis

Lawrence E Lach

Krishna D Jonnalagadda

Hakeem B Adewole

Karl W Wyatt

Chao-pin Yeh

Wen Xu Zhou

Kin P Tsui

Abhijit Roy Chowdhuri

Gregory Joseph Dunn

Julius S Gyorfi

Tomasz L Klosowiak

Swee Mean Mok

Min-Xian M Zhang

Michael Hertsberg

Colleen Mary Walsh

Mansour Toloo

Debabrata Pal

Robert W Pennisi

Sanjar Ghaem

Timothy J Collins

Kurt A Estes

Cynthia M Melton

Kevin J McDunn

Chowdary Ramesh Koripella

Aroon V Tungare

Richard Stanley Rachwalski

Alan G Chen

Sean Xin Wu

Robert Kenneth Doot

Frank E Filisko

Robert Perri

Irina Shmagin

Brian L Mueller

Irina Konstantinonva Shmagin

Anindya Dasgupta

George Amos Carson, Jr

Kevin Mcdunn

Kurt Estes

Marc K Chason

Abhijit R Chowdhuri

Described are antimicrobial liquid products comprising one or more antimicrobial organometallic additives dispersed throughout an organic host liquid.

Liquid material systems with multifunctional organometallic additives

Described are antimicrobial polymer products made from mixtures of antimicrobial organometallic additives dispersed throughout a polymer host matrix.

Antimicrobial polymer systems using multifunctional organometallic additives for polyurethane hosts

A liquid purification system is provided. Although not limited to water, the purification system is especially suitable for water. The purification system utilizes a vessel having antimicrobial inner wall load bearing surfaces and/or antimicrobial (antibacterial, anti-fungal, anti-mold, etc.) interior non-load bearing surfaces. When the liquid moves within the vessel and contacts the antimicrobial surfaces, the liquid becomes purified or sanitized. The inner wall load bearing surfaces and non-load bearing interior surfaces of the vessel may be manufactured from a host polymer that has antimicrobial organo-metallic additives which form a solid-solution with the host polymer and are distributed homogeneously throughout the host polymer. The host polymer matrix may be an organic material, an inorganic material or an organic-inorganic material blend. The antimicrobial agent polymer matrix may be located in localized zones within the vessel.

Liquid purification system

Antimicrobial polymer systems using multifunctional organometallic additives for wax hosts

A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.

Method to pattern metallized substrates using a high intensity light source

A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards. The rapid thermal stress may be induced by a high intensity, strobed xenon arc lamp.

Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board

A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value. The peak exposure temperature is then be calculated as a function of the difference value.

Method and apparatus for a temperature sensor for measuring peak temperatures

An electroluminescent display device contains an electroluminescent phosphor sandwiched between a pair of electrodes and a graphic arts element. The device is fabricated by bonding a generic electroluminescent base laminate containing an electrode and an electroluminescent layer, to a custom graphic arts film containing a graphic element and a corresponding electrode. The generic electroluminescent base laminate is made at a first location or time, and the custom graphic arts film is made at a second location or time.

Method of manufacturing customized electroluminescent display

A protective photochromic barrier film for a light-sensitive printed electronic substrate. Light-sensitive semiconductor devices on a dielectric substrate are electrically connected by conductors. A barrier layer containing photochromic dyes covers some or all of the light-sensitive semiconductor devices. Upon exposure to visible, infrared, or ultraviolet light, the photochromic dyes change chemical structure and decrease the amount of visible or non-visible light that can impinge upon the light-sensitive electronic devices. Upon removal of the visible or non-visible light, the photochromic dyes either revert to their original structure or maintain their altered state.

Printed electronic substrate havine photochromic barrier layer

An electroluminescent display contains an array of dynamically addressable pixels. The pixels are arranged on one side of a carrier substrate. Conductive vias in the substrate are electrically connected to each of the pixels. Each pixel consists of a bottom electrode that is coupled to a via, an electroluminescent material, and a dielectric material. A common top electrode is disposed on the dielectric material. A driver circuit conductor or connector is situated on the other side of the substrate and is electrically coupled to each of the conductive vias and to the common top electrode, so that each pixel can be individually addressed to illuminate the electroluminescent material on individual pixels.

Electroluminescent display having a pixel array

An inverter circuit () having a drive transistor () that operably couples to a voltage bias input () (and where that drive transistor controls the inverter circuit output by opening and closing a connection between the output () and ground ()) is further operably coupled to a feedback switch (). In a preferred approach the feedback switch is itself also operably coupled to the voltage bias input and the output and preferably serves, when the drive transistor is switched 'off,' to responsively couple the voltage bias input to the drive transistor in such a way as to cause a gate terminal of the drive transistor to have its polarity relative to a source terminal of the drive transistor reversed and hence permit the inverter circuit to operate across a substantially full potential operating range of the drive transistor.

Inverter circuit having a feedback switch and methods corresponding thereto

An object () (such as a containment mechanism) supports both a functional electrical circuit () and an electrical circuit () to which the functional electrical circuit is responsive. In a preferred approach the functional electrical circuit has both a low power state of operation and a higher power state of operation. Upon detecting () that an area of connectivity of the electrical circuit has been severed (via, for example, corresponding manipulation of the object itself), the functional electrical circuit responsively operates () using the higher power state of operation.

Containment mechanism manipulation responsive electrical circuit power usage apparatus and method

An electronic apparatus, includes a plurality of electronic modules, each having a maximum thickness of no more than 90 microns, each comprising a substrate having a two sided edge connection pattern. The electronic modules are arranged adjacent to each other. Each pad of a first set of connection pads on a first electronic module is conductively connected to an opposing pad of a second set of connection pads of a second electronic module. The first set of connection pads is separated from the second set of connection pads by electrically conductive material that is less than 15 microns thick.

Electronic module interconnection apparatus

Growing community of inventors

Palatine, IL, United States of America

Daniel Roman Gamota