Siemens Aktiengesellschaft

Infineon Technologies Ag

Finisar Corporation

Siemens Energy Global Gmbh & Co. Kg

Siemens Gamesa Renewable Energy A/s

Daniel Reznik

Oliver Stier

Ursus Krüger

Frank Heinrichsdorff

Hans-Joachim Schulze

Arno Steckenborn

Mario Festag

Henrik Stiesdal

Harry Hedler

Jens Dahl Jensen

Ralph Reiche

Volker Plickert

Lutz Melchior

Dirk Scheibner

Jörg Hassel

Olaf Rehme

Martin Schäfer

Werner Kuhlmann

Oliver Theile

Melanie Ring

Nicola Iwanowski

Oliver Hofacker

Hans-Richard Kretschmer

Karlheinz Amtmann

Klaus Röther

Benjamin Prodinger

Frank Meyer-Güldner

Heinz Neubert

Darya Kastsian

Dominik Braun

Hans-Peter Lindner

Delphine Meunier

Maryam Vakilzadeh Moghaddam

Wolfgang Eckhard

Various embodiments include a heat sink comprising: a base plate with an assembly surface for an electronic component; and a cooling structure bonded to the base plate increasing a surface area of the heat sink. The base plate comprises a metal-ceramic composite with a ceramic phase and a metallic phase. The cooling structure comprises a metal. A bond between the cooling structure and the base plate consists of a purely metallic bond between the cooling structure and the metallic phase of the base plate.

Heat sink for an electronic component

Various embodiments include a method for additive manufacturing of a building structure on using a simulation comprising: accessing a data set for the building structure describing the building structure in layers; calculating a global heat development in previous layers based a building history and heat input by an energy beam; determining a local heat development in a vicinity of the heat input; determining the process control based on the global and the local heat development; loading correction measures from a database; and assigning the correction measures locally to individual vectors of a tool path of the energy beam. At least one mass integral is calculated for individual vectors of the tool path. The measures are determined on the basis of a comparison of the calculated mass integral with mass integrals stored in the database.

Method for determining building instructions for an additive manufacturing method, method for generating a database with correction measures for controlling the process of an additive manufacturing method

The present disclosure relates to powder-bed-based additive manufacturing processes. Embodiments thereof may include methods for producing a component from a superalloy. For example, a method for producing a component comprising a superalloy may include: preheating a powder bed comprising particles of a core material coated by a ceramic layer, the core material including alloying constituents of the superalloy and building up the component layer by layer in a powder bed by melting particles with an energy beam. The powder bed may be heated to a temperature below a melting point of the core material before the particles are melted.

Powder-bed-based additive manufacturing process

Various embodiments may include a method for the generative manufacturing of a component on a building platform comprising: applying particles of a building material layer by layer to the building platform and then to the component under construction; fusing the applied particles with an energy beam; and heating the component under construction with a heating device associated with the building platform. A reference temperature Tfor each layer produced and a tolerance range for the reference temperature Tare defined. A heating power of the heating device is lowered as sequential layers are fused to the extent that the tolerance range for a reference temperature Tis maintained in a last layer produced.

Generative manufacturing of components with a heatable building platform and apparatus for implementing this method

The present disclosure relates to coating a carrier component by means of cold gas dynamic spraying. For example, a method for coating a carrier component may include: laying a mask with an opening on the component; depositing a material through the opening to completely fill up the mask opening; removing any material located above the upper side to form a flat surface even with the upper side of the mask; laying a second mask on the first mask; depositing the material again; removing any deposited material located above the upper side of the second mask to form a flat surface even with the upper side of the second mask; repeating layers of additional masks and material deposition until the deposited material reaches a required thickness on the carrier component; and after completion of the coating to the required thickness, removing the masks.

Cold gas dynamic spraying using a mask

A component is produced in layers by laser melting. A molten pool is created in a bed of powder by a working laser beam. Further auxiliary laser beams are set to a power density that merely slows down the cooling of the material in one zone, but do not cause any renewed melting. In this way, the cooling rate of the microstructure can be set so that an advantageous structural formation develops. This allows for example the mechanical properties of the component produced to be advantageously improved without downstream heat treatments.

Method for laser melting with at least one working laser beam

An installation for storing thermal energy is provided. The storage is carried out by the compression and relaxation of a working gas, wherein pump and compressor can be driven by, for example, electric motors which temporarily absorb excess power generated in the power grid. The generated thermal energy is temporarily stored in a cold accumulator and a heat accumulator. According to the invention, a vapor circuit is provided to connect to the heat accumulator and the cold accumulator for discharging the installation, by which a turbine for generating electrical energy can be driven by a generator. Said circuit is implemented by means of another conduit system distinct from the circuit for charging the installation. Advantageously, thermal energy generated from overcapacities in the power grid can thus be reconverted with high yield into electrical energy via a vapor circuit.

Installation for storing thermal energy

A force transducer, in particular a load cell, includes a spring body that deforms when loaded with a force or load to be measured. Two support parts, which are separated by a gap, are moved out of a position of rest. A capacitive displacement detector is used to detect the relative movement of the support parts, where the capacitor includes two electrode combs that are each held on one of the support parts and includes a multiplicity of electrode fingers. The electrode combs are configured designed and mounted on the two support parts such that the electrode fingers of the one electrode comb pass into the finger interspaces of the other electrode comb when the spring body is loaded so that the force transducer is resistant to overloading.

Force transducer forming a capacitive load cell

A central tube for linear concentrating solar thermal power plants, has an absorber layer. The absorber layer is generated by cold gas sputtering, wherein suitable method parameters can in particular generate an increased surface roughness by means of pores in the surface region of the absorber layer. An absorber layer can thus be advantageously produced, having a quadratic roughness of no more than 1 &#x3bc;m, measured in a close range of no more than 50 &#x3bc;m diameter, and preferably being made of a corrosion-proof hard alloy comprising tungsten carbide, in particular WC&#x2014;CoCr, WC&#x2014;Co, WC&#x2014;FeCo, WC&#x2014;FeC, WC&#x2014;FeNi, WC&#x2014;Ni or WC&#x2014;NiCr.

Central tube for a linear concentrating solar thermal power plant, having an absorber layer, and method for applying said absorber layer

A method for the electrochemical coating of a substrate uses brush plating. This is to take place with an electrolyte in that particles are dispersed, which are embedded into the developing layer. It is proposed to add the particles to the carrier for the electrolyte by way of a separate conduit system. The electrolyte is added by way of a conduit system. In this way it is achieved that an agglomeration of the particles in the electrolyte can be prevented because only a short time passes between when the particles are fed and the layer is formed. A device for electrochemical coating has two conduit systems provided for this purpose.

Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method

An optical transmitting and/or receiving device has a semiconductor component with a first contact for connecting to a reference voltage and a second contact for obtaining or supplying a high-frequency electrical signal. There is also an electrically conducting carrier substrate with a first surface and a second surface. The semiconductor component is configured on the first surface of the carrier substrate. The second surface of the carrier substrate has a metallization that can be connected to a reference voltage applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate. The first contact of the semiconductor component is electrically connected to the first contacting region.

Optical transmission and/or receiving device

The invention relates to an electrical printed circuit board serving for electrical contact-connection of an integrated circuit. The printed circuit board has a dielectric forming the printed circuit board material; at least one ground inner layer connected to ground potential; and a supply voltage inner layer connected to the potential of the supply voltage. The invention further includes at least one locally formed inner layer electrically connected to the supply voltage inner layer; a first external terminal contact serving for electrical connection to a ground terminal of an integrated circuit; and a second external terminal contact serving for electrical connection to a supply voltage terminal of an integrated circuit. In addition, a first contact-connection is provided between the first external terminal contact and the at least one ground inner layer; and a second contact-connection is provided between the second external terminal contact and the at least one locally formed inner layer. The at least one locally formed inner layer and the at least one ground inner layer provide a printed circuit board decoupling capacitor for an integrated circuit.

Electrical printed circuit board

A waveguide which is particularly suitable for transmitting electrical signals between or to and/or from electronic circuits, for example between integrated circuits disposed on a printed circuit board, has an over-voltage protection region. The over-voltage region of the waveguide region is specifically formed by the actual geometric configuration of the waveguide.

Waveguide

An arrangement including an optoelectronic component having terminal contacts, an electrical component having first electrical contacts and second electrical contacts, a printed circuit board, to which the second electrical contacts of the electrical component are connected, and a flexible conductor arrangement of a planar form having several conductor tracks. The conductor arrangement provides an electrical connection between the terminal contacts of the optoelectronic component and the first electrical contacts of the electrical component. The conductor arrangement has a first region with first contact regions and a second region with second contact regions. The optoelectronic component is mounted directly on the first region and its terminal contacts are connected to the first contact regions, and/or the electrical component is mounted directly on the second region and its first electrical contacts are connected to the second contact regions.

Arrangement for the electrical connection of an optoelectronic component to an electrical component

A thyristor having a first zone, a second zone, a third zone, and a fourth zone. At least one control electrode is connected to the second and/or third zone. In order to reduce the static and dynamic power loss in a symmetrical thyristor, it is proposed that a field stop zone of the second conductivity type be disposed approximately in the center of the second zone, with the result that it subdivides the second zone into two sections of essentially the same size. To that end, the field stop layer is produced on an inner surface of a first wafer or of a second wafer, and the first wafer is connected to the second wafer, such that the two inner surfaces of the two wafers lie one on top of the other.

Growing community of inventors

Berlin, Germany

Daniel Reznik