Northrop Grumman Systems Corporation

Daniel R Scherrer

Dah-Weih Duan

Elizabeth Twyford Kunkee

Chunbo Zhang

Ming-Jong Shiau

Dino Ferizovic

Greta S Tsai

Jesse B Tice

Xing Lan

Xianglin Zeng

Martin E Roden

Patrick J Case

Martn E Roden

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

RF circuit and enclosure having a micromachined interior using semiconductor fabrication

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. Other metal traces on the other surface of the substrate also provide reference ground. Bottom and top enclosures that enclose the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the bottom and top enclosures engage reference ground metal traces on respective surfaces of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

Filter with an enclosure having a micromachined interior using semiconductor fabrication

A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.

Large-scale reconfigurable electronics using low cost nanoparticle ink printing method

A RF amplifier circuit including a plurality of FET devices, where a source terminal of an FET device is electrically coupled to the drain terminal of another FET device. The circuit further includes a voltage divider network and a plurality of operational amplifiers, where a separate one of the operational amplifiers is provided for each FET device. Each operational amplifier includes a positive input terminal, a negative input terminal and an output terminal, where the output terminal for a particular operational amplifier is electrically coupled to a gate terminal of a particular FET device, the negative input terminal of each operational amplifier is electrically coupled to the source terminal of the particular FET device and the positive input terminal of each operational amplifier is electrically coupled to the voltage divider network. A source resistor is electrically coupled to the source terminal of a bottom FET device in the stack.

Stacked bias I-V regulation

Growing community of inventors

Glendale, CA, United States of America

Daniel R Scherrer