Lockheed Martin Corporation

Daniel R Morgenthaler

David M Barnett

Edward Nathan Harris

Suraj Prakash Rawal

William H Willcockson

Janine M Thornton

Michael G Thornton

Kenneth P Romeo

Michael A Sasdelli

An integrated sample return capsule for use in returning materials to Earth from space, such as core samples from other celestial bodies and experiments from orbiting platforms. The sample return capsule incorporates thermal protection, structural integrity and impact mitigation into a single system capable of safely and securely returning the materials without requiring decelerating parachutes. In one embodiment, the integrated sample return capsule includes a forward facing heat shield and a back shell attached to the rear of the heat shield. The heat shield and the back shell define an interior enclosure. The back shell includes an access, such as a door or a removable panel, there through to the interior enclosure. Materials to be returned may be sealed in a sample containment vault, and the sealed vault may be placed into the interior enclosure through the access. An optional support deck may be provided within the interior enclosure for receiving the sample containment vault and supporting the vault within the interior enclosure.

Integrated sample return capsule

A method and system for making monolithically integrated thin film photovoltaic is disclosed. In one embodiment of the system, a device for directing electromagnetic energy having a selected frequency is utilized to electronically excite a portion of a second medium on the surface of a substrate to facilitate reaction with an excitable deposition medium. The frequency may be selected such that the desired reaction between the excited second medium and deposition medium is facilitated and side reactions and incorporation of impurities into the thin film are minimized. Multiple layers may be formed by selecting additional frequencies, if necessary. The method of the present invention allows formation of monolithically integrated thin films without removing material from the substrate surface between deposition steps. In one embodiment, the method of the present invention includes the steps of providing a first excitable deposition medium, providing a substrate having a second medium positionable thereon, selecting a frequency of electromagnetic energy to excite the second medium, and directing electromagnetic energy having the selected frequency on at least a portion of the second medium to excite the medium to an excited state to facilitate a reaction with the excitable deposition medium, the product of such reaction being a first thin film deposit on the substrate.

Electromagnetic beam assisted deposition method for depositing a

A vibration attenuation system (10) is disclosed for at least partially isolating a structure (16) from a vibrating source (14). The system (10) generally includes a differential stiffness assembly (12) interposed between the vibration source (14) and the structure (16), a vibration sensor (18) for sensing a vibration from the source (14), a controller (20) for controlling operation of the differential stiffness assembly (12) based on a sensed vibration from the source (14), and an actuator for varying a load applied to the differential stiffness assembly (12) in response to control signals from the controller (20). The differential stiffness assembly (12) includes an element such as a metallic tube (30), that provides a variable frequency-related vibration transmission/attenuation response depending on a load applied to the member. In one embodiment, a shape memory alloy wire (28) is interconnected to the tube (30) to apply a varying load to the tube (30) depending on a temperature of the wire (28).

Differential Stiffness system for attenuating vibrations

Modular and multifunctional structure

An electrical socket used for interconnecting a multichip module to a printed circuit board or similar electrical system. The electrical socket is independent of the multichip module and permits removal and replacement of the multichip module without damaging the module and its module electrical leads. The socket includes an insulated base strip and an insulated cap strip. The base strip includes a plurality of elongated lower pockets therein for receiving and properly aligning each of the module electrical leads therein. The base strip also includes conductive pads in the bottom of and along the length of each pocket. Each conductive pad is connected to a socket lead. The socket leads are used for connection to the printed circuit board or like electrical system. The cap strip includes a plurality of elongated upper pockets therein which are dimensioned for receipt above the lower pockets of the base strip. The module electrical leads are curved sinusoidally so that when the cap strip is received on top of the base strip, the module electrical leads are compressed inside the upper and lower pockets. The compliance of the leads inside the electrical socket provides for maintaining good electrical contact during various environmental stresses such as temperature fluctuations and vibrations found during aircraft and spacecraft flight.

Growing community of inventors

Littleton, CO, United States of America

Daniel R Morgenthaler