International Business Machines Corporation

Globalfoundries Inc.

Daniel R Miga

Anthony K Stamper

Zhong-Xiang He

Eric Jeffrey White

Russell T Herrin

Daniel Scott Vanslette

Matthew D Moon

David A DeMuynck

The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance inductors. The IC includes at least one trench within a dielectric layer disposed on a substrate. The trench is conformally coated with a liner and seed layer, and includes an interconnect within. The interconnect includes a hard mask on the sidewalls of the interconnect.

Integrated circuit and interconnect, and method of fabricating same

Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.

Semiconductor structure

Growing community of inventors

St. Albans, VT, United States of America

Daniel R Miga