Metaland LLC

Daniel Pierrard

Darren Molloy

A method of making a smartcard may comprise: providing a metal layer (ML) having a module opening (MO) extending from a front surface of the metal layer to a rear surface thereof; providing a sacrificial layer (SL) on the front surface of the metal layer; filling (from behind) the module opening with thermosetting resin (TR); allowing the thermosetting resin to cure (harden); removing the sacrificial layer; and from the front surface of the metal layer, milling a cavity in the cured (hardened) thermosetting resin for receiving a transponder chip module (TCM). A chip module may be implanted in the milled-out cavity, wherein the thermosetting resin provides mechanical support to the chip module and electrical insulation of the chip module from the metal layer. The smartcard may be 'dual-interface'.

Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card

Encapsulating the rear side of a top metal layer of a metal transaction card with a thermosetting resin, applying a primer to the front side of the top metal layer and drying in an oven before spraying a thermoset powder coating thereon, laser etching and mechanically engraving graphic elements into the powder coating to reveal the bare metal surface, inkjet printing graphic features to the powder coat. Encapsulating the rear side of a bottom metal layer of the card with a thermosetting resin, applying a primer to the rear side of the bottom metal layer and drying in an oven before digitally printing artwork, applying a protective overlay layer with magnetic stripe to the printed graphics, applying a primer or an adhesive film to the thermosetting to enable lamination of the top metal layer to the bottom metal layer.

Plating and coating of RFID enabled metal transaction cards with mechanically engraved and laser etched features

Metal layers () of a smartcard (SC,) have module openings () for receiving a transponder chip module (TCM). Thermosetting resin (TR,B,A,B,A,B) coats (encapsulates) the bottom surfaces and fills the module openings of the metal layers. A first metal layer () may have a slit (S;B,) which may also be filled by the thermosetting resin. A second metal layer (ML,) disposed above the first metal layer () may have a slit (S,A) which may also be filled by the thermosetting resin. A booster antenna circuit (BAC,) may be disposed between the first and second metal layers, with magnetic shielding material () disposed between the booster antenna circuit and the second metal layer ().

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Killour, Ireland

Daniel Pierrard