Rini Technologies, Inc.

University of Central Florida Research Foundation Inc

Daniel P Rini

Louis Chow

H Randolph Anderson

Jayanta Kapat

Bradley G Carman

Brian Gulliver

Jose Mauricio Recio

Benjamin Saarloos

Guochang Zhao

Michael Bass

James C Hughes

Te-Yuan Chung

Brian Zinck

Nick Williams

The subject invention pertains to a method and apparatus for an orientation independent compressor. The subject compressor can be part of a vapor compression cycle system, and can use one or more of a variety of working fluids, including, but not limited to, refrigerants such as r-134a, r-22, CO, and NH. Embodiments of the compressor can utilize positive displacement apparatus to compress the vapor. In a specific embodiment, the compressor can incorporate an oil-lubricated rotary lobed type positive displacement compressor. In a further specific embodiment, the working fluid vapor can be a refrigerant, such as r-134a, incorporating entrained oil, such as miscible lubricating oils. An example of such a miscible lubricating oil that can be used is polyester (POE) oil.

Method and apparatus for orientation independent compression

The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber. The subject invention uses a high thermal conductivity host material to house a lower thermal conductivity phase change material, in order to achieve a thermal energy absorber that has a high effective thermal conductivity. In a specific embodiment, the high thermal conductivity host material has voids within the structure that can be filled by the phase change material. The increased surface area of phase change material in thermal contact with the host material per volume of phase change material allows the thermal energy to be stored or released quickly, because of the enhanced effective thermal conductivity.

Method and apparatus for absorbing thermal energy

The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid. In another specific embodiment, an outer layer can be positioned above the heat transfer surface to create a volume between the heat transfer surface and the outer layer through which the external fluid can flow.

Method and apparatus for highly efficient compact vapor compression cooling

The subject invention pertains to a spray nozzle apparatus and method of use. The subject spray nozzle can be used to spray atomized fluid. The atomized fluid can then be incident on a heated surface such that heat is transferred from the heated surface to the atomized fluid. The subject invention also relates to a spray-cooling system and method of use. The subject spray-cooling system can incorporate a spray nozzle and a heat transfer plate. A device to be cooled, such as a laser diode, microwave amplifier, or other high power electrical device, can be placed in direct thermal contact with the heat transfer plate. The spray from the spray nozzle can then be sprayed onto the heat transfer plate. In a specific embodiment, a cellular transfer plate can be used and the spray from the spray nozzle can be sprayed into a cellular cavity or compartment, within the heat transfer plate. Heat is transferred from the heat source to the sprayed liquid via the wall of the heat transfer plate. The heat transfer plate can be attached to the spray nozzle housing, such that as the sprayed liquid exits the spray nozzle housing, the sprayed liquid enters a cellular cavity of the cellular heat transfer plate. Removing the cellular heat transfer plate from the spray-cooling assembly can allow the apparatus to be used as a conventional spray nozzle.

Spray nozzle apparatus and method of use

The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat. The coolant can be sprayed onto the surface, for example, as a stream of liquid after being atomized, or in other ways which allow the coolant to contact the surface and absorb heat. Once the heat is absorbed by the coolant, the coolant can be transported to another location so as to transport the absorbed heat as well.

Method and apparatus for high heat flux heat transfer

The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber. The subject invention uses a high thermal conductivity host material to house a lower thermal conductivity phase change material, in order to achieve a thermal energy absorber that has a high effective thermal conductivity. In a specific embodiment, the high thermal conductivity host material has have voids within the structure that can be filled by the phase change material. The increased surface area of phase change material in thermal contact with the host material per volume of phase change material allows the thermal energy to be stored or released quickly, because of the enhanced effective thermal conductivity.

The subject invention relates to beam control prisms and the use of a beam control prism to modify the beam properties of light emitted from an edge emitting diode laser. The subject invention can utilize a beam control prism placed next to a diode laser bar. The subject beam control prism can have, for example, a curved surface and/or a high reflective coated surface for a diode laser wavelength. The curved surface can collimate the fast axis divergence and the mirror surface can change the beam direction. The subject curved surface beam control prisms can incorporate one or more features, such as parabolic reflecting surface, elliptical exit surface with flat reflecting surface, and a hyperbolic entrance surface with flat reflecting surface.

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Orlando, FL, United States of America

Daniel P Rini