International Business Machines Corporation

Daniel P Kirby

Renuka S Divakaruni

Jon Alfred Casey

Robert W Nufer

Steven M Kandetzke

John Ulrich Knickerbocker

Sarah Huffsmith Knickerbocker

James N Humenik

Srinivasa S Reddy

Mark A Takacs

John Acocella

Richard A Bates

Arnold I Baise

Lovell B Wiggins

David R Clarke

Amy T Matts

Charles Hampton Perry

Lawrence D David

Ajay Prabhakar Giri

George Czornyj

Herbert R Anderson, Jr

Anthony Mastreani

Peter A Agostino

Salvatore J Scilla

Liang-Choo Hsia

Werner E Dunkel

Allen J Dam

Ray M Bryant

Krishna Gandhi Sachdev

Harbans S Sachdev

Raj N Master

Constance J Araps

Darbha Suryanarayana

Stoyan M Zalar

Joseph M Dynys

Hopper mate for drywall texturing gun

The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Process for fabricating a low dielectric composite substrate

Low dielectric composite substrate

The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

Method of making multilayered ceramic structures having an internal

In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.

Method of bonding inorganic particulate material

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Daniel P Kirby