Motorola Corporation

Freescale Semiconductor,inc.

Mcube, Inc.

Silicon Laboratories Inc.

Daniel N Koury, Jr

Andrew C McNeil

Ronald J Gutteridge

Gary G Li

Emmanuel Philippe Quevy

Jonathan H Hammond

Walter C Seelbach

Anthony Francis Flannery, Jr

Ljubisa Ristic

Sudheer S Sridharamurthy

Daniel J Koch

Helen M Zunino

Lianjun Liu

Bishnu Prasanna Gogoi

Jonathan Hale Hammond

Paul T Bennett

Aaron A Geisberger

Henry G Hughes

David F Mietus

Melvy Freeland Miller, Iii

Howard M Berg

Guang X Li

Frank A Shemansky, Jr

Zuoying Lisa Zhang

Richard J August

John E Schmiesing

David W Stevenson

Jonathan F Gorrell

A microelectromechanical system (MEMS) device includes a temperature compensating structure including a first beam suspended from a substrate and a second beam suspended from the substrate. The first beam is formed from a first material having a first Young's modulus temperature coefficient. The second beam is formed from a second material having a second Young's modulus temperature coefficient. The body may include a routing spring suspended from the substrate. The routing spring may be coupled to the first beam and the second beam. The routing spring may be formed from the second material. The first beam and the second beam may have lower spring compliance than the routing spring. The MEMS device may be a resonator and the temperature compensating structure may have dimensions and a location such that the temperature compensation structure modifies a temperature coefficient of frequency of the resonator independent of a mode shape of the resonator.

Temperature compensation for MEMS devices

An improved MEMS transducer apparatus and method. The method includes providing a movable base structure having a base surface region overlying a substrate and a center cavity with a cavity surface region. At least one center anchor structure and one spring structure can be spatially disposed within a substantially circular portion of the surface region. The spring structure(s) can be coupled the center anchor structure(s) to a portion of the cavity surface region. The substantially circular portion can be configured within a vicinity of the center of the surface region. At least one capacitor element, having a fixed and a movable capacitor element, can be spatially disposed within a vicinity of the cavity surface region. The fixed capacitor element(s) can be coupled to the center anchor structure(s) and the movable capacitor element(s) can be spatially disposed on a portion of the cavity surface region.

Method for fabricating a transducer apparatus

An improved MEMS transducer apparatus and method is provided. The apparatus has a movable base structure including an outer surface region and at least one portion removed to form at least one inner surface region. At least one intermediate anchor structure is disposed within the inner surface region. The apparatus includes an intermediate spring structure operably coupled to the central anchor structure, and at least one portion of the inner surface region. A capacitor element is disposed within the inner surface region.

Transducer structure and method for MEMS devices

A method and structure for adding mass with stress isolation to MEMS. The structure has a thickness of silicon material coupled to at least one flexible element. The thickness of silicon material can be configured to move in one or more spatial directions about the flexible element(s) according to a specific embodiment. The apparatus also includes a plurality of recessed regions formed in respective spatial regions of the thickness of silicon material. Additionally, the apparatus includes a glue material within each of the recessed regions and a plug material formed overlying each of the recessed regions.

Method and structure for adding mass with stress isolation to MEMS structures

A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation.

Monolithic body MEMS devices

A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation. An apparatus includes a MEMS device including a first electrode and a second electrode, and a body suspended from a substrate of the MEMS device. The body and the first electrode form a first electrostatic transducer. The body and the second electrode form a second electrostatic transducer. The apparatus includes a suspended passive element mechanically coupled to the body and electrically isolated from the body.

Suspended passive element for MEMS devices

An improved MEMS transducer apparatus and method. The apparatus has a movable base structure including an outer surface region and an inner surface region. At least one central anchor structure can be spatially disposed within a vicinity of the inner surface region and at least one peripheral anchor structure can be spatially disposed within a vicinity of the outer surface region. Additionally, the apparatus can have at least one peripheral spring structure. The peripheral spring structure(s) can be coupled to the peripheral anchor structure(s) and at least one portion of the outer surface region. The apparatus can also have at least one central spring structure. The central spring structure(s) can be operably coupled to the central anchor structure(s) and at least one portion of the inner surface region.

Package tolerate design and method

An improved MEMS transducer apparatus and method is provided. The apparatus includes a movable base structure having a base surface region. An anchor structure is disposed within a substantially circular portion of the surface region typically at or near the center of the surface region. A spring structure is coupled to the anchor structure and at least one portion of the base surface region. A capacitor, having a fixed capacitor element and a movable capacitor element, are disposed near the base surface region. The fixed capacitor element can be coupled to the anchor structure and the movable capacitor element can be spatially disposed on a portion of the base surface region near the anchor structure.

Anchor design and method for MEMS transducer apparatuses

A microelectromechanical systems (MEMS) sensor () includes a substrate () a movable element () spaced apart from the substrate (), suspension anchors () formed on the substrate (), and compliant members () interconnecting the movable element () with the suspension anchors. The MEMS sensor () further includes fixed fingers () and fixed finger anchors () attaching the fixed fingers () to the substrate (). The movable element () includes openings (). At least one of the suspension anchors resides in at least one of the multiple openings () and pairs () of the fixed fingers () reside in other multiple openings (). The MEMS sensor () is symmetrically formed, and a location of the fixed finger anchors () defines an anchor region () within which the suspension anchors () are positioned.

Semiconductor device with reduced sensitivity to package stress

A microelectromechanical systems (MEMS) componentincludes a portionof a MEMS structureformed on a semiconductor substrateand a portionof the structureformed in a non-semiconductor substrate. The non-semiconductor substrateis in fixed communication with the semiconductor substratewith the portionof the MEMS structurebeing interposed between the substratesand. A fabrication methodentails utilizing semiconductor thin-film processing techniques to form the portionon the semiconductor substrate, and utilizing a lower cost processing technique to fabricate the portionin the non-semiconductor substrate. The portionsandare coupled to yield the MEMS structure, and the MEMS structurecan be attached to another substrate as needed for additional functionality.

Microelectromechanical systems component and method of making same

A MEMS device that has a sensitivity to a stimulus in at least one sensing direction includes a substrate, a movable mass with corner portions suspended in proximity to the substrate, at least one suspension structure coupled approximately to the corner portions of the movable mass for performing a mechanical spring function, and at least one anchor for coupling the substrate to the at least one suspension structure. The at least one anchor is positioned approximately on a center line in the at least one sensing direction.

MEMS suspension and anchoring design

A MEMS device includes a substrate; a movable mass suspended in proximity to the substrate; and at least one suspension structure coupled to the movable mass for performing a mechanical spring function. The at least one suspension structure has portions that move in tandem when the MEMS device is subject to at least one stimulus in a sensing direction, and further includes at least one link between the portions that move in tandem.

MEMS device and method of reducing stiction in a MEMS device

MEMS devices () and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device () comprises a substrate () having a surface, an electrode () having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism () disposed on the electrode second portion, the stress-release mechanism () including a first slot () integrally formed in the electrode. In another exemplary embodiment, the substrate () includes an anchor () and the stress-release mechanismis formed adjacent the anchor ().

Growing community of inventors

Mesa, AZ, United States of America

Daniel N Koury, Jr