Siemens Aktiengesellschaft

Daniel Metz

Stefan Dietrich

Lothar M&uuml;ller

Werner Jung

Birgit Haase

A workpiece, designed as a printed circuit board for example, can be moved by means of a transport device under a laser unit in such a way that a region to be machined of the workpiece passes into the deflecting region of the laser beam. The workpiece is set between clamping jaws to a vertical position in which the laser beam is focused exactly on that surface of the workpiece which is to be machined. As a result, the machining accuracy can be considerably increased.

Device for the laser processing of flat workpieces

Workpieces in the shape of plates can be transported from an input station to a workstation and from there to an output station by means of two manipulation device in a working plane. A gripper of one of the manipulation means can be displaced between the input station and the workstation. The gripper of the other manipulation device can be displaced between the workstation and the output station, whereby the displacement ranges overlap. As the first half of the processing time has been approximately completed in the workstation, the workpiece r is transferred from the gripper on the input side to the gripper on the output side. Meanwhile, the respectively free gripper returns to its station and to the workstation, so that the processing can be carried out almost without any interruption.

Growing community of inventors

Kandel, Germany

Daniel Metz