Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Renault S.a.s.

Daniel Mermin

Daniel Chatroux

Olivier Guillermin

Jérémy Dupont

Pierre Montmeat

Frédéric Gaillard

Arnaud Garnier

Anthony De Luca

Laetitia Castagne

A serigraphy method for producing a soulder bump on the front surface of a substrate includes: forming a film on the front surface, forming an opening in the film, filling the opening with a souldering material, and removing the film. Forming a film on the front surface is preceded by the formation of an intermediate layer between the film and the front surface, the intermediate layer being adapted to exhibit a force of adherence at one and/or the other interface formed with the first front surface and the film lower than the force of adherence that can be formed between the film and the first front surface.

Method for producing a solder bump on a substrate surface

The invention concerns an electrical connection system, comprising a helical electrical cable () having a spring effect and a device () for storing the cable, comprising at least one first pulley () for guiding the cable.

Storage for electric cable

The invention relates to a winding device () for an electric cable () including a cylindrical hub (), perforated () at its surface and open () at at least one of its ends, the cable having at least one conductor () and a sheath () with an outer surface having an irregular cross-section.

Electric cable and winding device for such a cable

Growing community of inventors

Sassenage, France

Daniel Mermin