International Business Machines Corporation

Other

Globalfoundries Inc.

Verisilicon Holdings Company Ltd.

Daniel Mark Dreps

Frank David Ferraiolo

Kevin Charles Gower

Glen Arthur Wiedemeier

Anand Haridass

Paul William Coteus

Robert J Reese

Jose A Hejase

Prasanna Jayaraman

Wiren Dale Becker

Kyu-hyoun Kim

Nam Huu Pham

Rohan U Mandrekar

Michael Sperling

Sungjun Chun

Ravi Kumar Arimilli

Warren Edward Maule

David William Boerstler

Hillery C Hunter

Jieming Qi

Charles Arthur Kilmer

David John Krolak

Steven John Baumgartner

Seongwon Kim

Bao G Truong

Daniel N De Araujo

Bhyrav M Mutnury

Robert Paul Masleid

Robert Brett Tremaine

Mark William Kellogg

Jinwoo Choi

Timothy O Dickson

Hayden C Cranford, Jr

Anthony Richard Bonaccio

James David Strom

Moises Cases

Roger Donell Weekly

Michael Anthony Sorna

John Stephen Muhich

Lloyd Andre Walls

George L Chiu

Gerard Vincent Kopcsay

David W Siljenberg

Luis Alfonso Lastras-Montano

Daniel Joseph Friedman

Brian Samuel Beaman

Todd Edward Takken

Robert H Dennard

Robert H Bell, Jr

John Francis Bulzacchelli

Michael Jay Shapiro

Edward Joseph Seminaro

Pier Andrea Francese

John Lee Colbert

Douglas James Joseph

Patrick Allen Buckland

Sergey Vladimirovich Rylov

Andreas H A Arp

Mounir Meghelli

Matthew James Paschal

Robert Russell Williams

Byron Lee Krauter

Delbert Raymond Cecchi

Joseph Paul Kuczynski

William John Starke

Claude Basso

Jeffrey A Stuecheli

Jean Louis Calvignac

Kirk David Peterson

Michael Steven Siegel

Lakshminarayana Baba Arimilli

Michael Stephen Floyd

Martin L Schmatz

Bartholomew Blaner

John Michael Borkenhagen

Hung Cai Ngo

Sudipto Chakraborty

Albert Manhee Chu

Pak-kin Mak

Jon Alfred Casey

Steven Michael Douskey

Kenneth Lee Wright

Kevin Franklin Reick

John David Irish

Kenneth Michael Valk

Louis Bennie Capps, Jr

Steven Paul Ostrander

Daniel Lawrence Stasiak

Samuel R Connor

Tobias Webel

Grant Paul Kesselring

Curtis Carl Wollbrink

Brian W Quinlan

David Michael Friend

Hubert Harrer

Carrie Ellen Cox

Paul William Rudrud

Charles L Reynolds

Eric John Lukes

Norman Karl James

Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

Multicomponent module design and fabrication

An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.

Dense via pitch interconnect to increase wiring density

Method and apparatus for transferring a data signal including receiving a digital data signal by a first data input of a transmitter multiplexer; inverting the digital data signal by a first inverter, thereby providing an inverted digital data signal; receiving the inverted digital data signal by a first inverted data input of the transmitter multiplexer; counting, by a first counter, a clock signal; transmitting, by the first counter and in response to the first counter counting a threshold number of clock cycles, a first selection signal to a first selection signal input of the transmitter multiplexer; and alternately transmitting, in response to the first selection signal and by a first digital data signal output of the transmitter multiplexer, the digital data signal and the inverted digital data signal as the transmitter output signal to a receiver, the receiver and the digital data signal output operably coupled to a data link.

Communication systems for power supply noise reduction

A two-chip die module with minimal chip-to-chip clock skew is provided. The two-chip die module includes a common substrate, first and second chips operably disposed on the common substrate to be communicative in parallel with one another and a single phase lock loop (PLL). The PLL is disposed within one of the first and second chips to provide a source for a common clock signal for the first and second chips. PLL signals of the PLL to the first and second chips are nearly equal and clock sample signals of the first and second chips are nearly equal.

Phase aligning and calibrating clocks from one phase lock loop (PLL) for a two-chip die module

Method and apparatus for transferring a data signal including receiving a digital data signal by a first input of a multiplexer of a transmitter operably coupled to a data link; transmitting, by a digital data signal output of the multiplexer, the digital data signal to a receiver that is operably coupled to the data link; receiving, by a selection signal input of the multiplexer, a first selection signal that indicates an idle mode for the transmitter; receiving, by a second input of the multiplexer, a patterned data signal; and transmitting, by the digital data signal output and in response to the first selection signal, the patterned data signal to the receiver.

An integrated circuit communication architecture is provided and includes a clock lane, a clock divider, and a first de-skew circuit. The clock lane is configured to send a clock signal at a first rate from a first chip to a second chip. The clock divider is on the second chip and is configured to receive the clock signal sent via the clock lane and to create and send a first divided clock signal and a second divided clock signal from the received clock signal. The divided clock signals are sent at reduced rates compared to the first rate. The clock divider maintains current mode logic properties for the divided clock signals. The first de-skew circuit is configured to receive and process the divided clock signals to allow for sampling of data transmitted from the first chip to the second chip.

Quadrature circuit interconnect architecture with clock forwarding

An enhanced quadrature receive serial interface circuit and methods are provided for calibrating the quadrature receive serial interface circuit. A quadrature receive serial interface circuit comprises a first phase rotator and a second phase rotator generating quadrature clocks of identical frequency. Calibration of the quadrature receive serial interface circuit uses a pseudo random bit sequence (PRBS) received by the quadrature receive serial interface circuit. For calibration, one-half of the received PRBS bits are sampled and the phase rotator generating in-phase 0° and 180° clock signals is adjusted to center the data eye for the sampled half of the PRBS bits. Then all data bits (even and odd data bits) of the received PRBS bits are sampled and the phase rotator generating quadrature phase 90° and 270° clock signals is adjusted to center the data eye of all data bits of the PRBS bits to complete calibration.

Calibrating a quadrature receive serial interface

Aspects of the invention include receiving, by a controller, an indication of a chip initialization for a duty cycle correction (DCC) circuit, wherein the duty cycle correction circuit includes a main path including a main multiplexer (MUX) having a first input and a main driver circuit, a replica path including a replica MUX having a second input and a replica driver circuit, a selection MUX connected to the main path and the replica path, operating the selection MUX, during a period for the chip initialization, to select the main path as an input to the selection MUX, inputting a pre-defined data pattern to the main path, comparing an output of the selection MUX with the pre-defined data pattern to determine duty cycle issue, and generating an adjustment vector based on the determined duty cycle issue.

Dual duty cycle correction loop for a serializer/deserializer (SerDes) transmitter output

A first oscillator signal and a second oscillator signal are transmitted to a processing unit. The first oscillator signal has a finite frequency or phase offset relative to the second oscillator signal. A first clock signal that is derived from the first oscillator signal is selected as a primary clock to clock the processing unit. A second clock signal derived from the second oscillator signal is aligned to the first clock signal. If a fault is detected on the first clock signal, the second clock signal is selected as the primary clock to clock the processing unit. Upon being selected as the primary clock, the phase of the second is stretched by one fixed phase for one clock cycle.

Redundant clock switch

Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.

Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)

A high-speed voltage clamping circuit includes p-type field effect transistor (PFET) biasing circuit, an n-type field effect transistor (NFET) biasing circuit, and a field effect transistor (FET) clamp circuit. The PFET biasing circuit is configured to generate a PFET biasing voltage. The NFET biasing circuit is configured to generate a NFET biasing voltage. The FET clamp circuit is in signal communication with the PFET biasing circuit and the NFET biasing circuit. The PFET biasing circuit controls operation of the clamping circuit in response to a voltage overshoot event and the NFET biasing circuit controls operation of the clamping circuit in response to a voltage undershoot event.

High-speed voltage clamp for unterminated transmission lines

A method includes determining a phase error for a first clock signal and a second clock signal and determining an offset based on the phase error for the first clock signal and the second clock signal. The method also includes adding the offset to a phase of the first clock signal to produce a first adjusted clock signal and subtracting the offset from a phase of the second clock signal to produce a second adjusted clock signal. A phase error for the first adjusted clock signal and the second adjusted clock signal is smaller than the phase error for the first clock signal and the second clock signal.

Adjustable phase shifter

A method includes connecting inputs of a first plurality of interpolation branches to a first clock signal, connecting inputs of a second plurality of interpolation branches to a second clock signal, and connecting inputs of a third plurality of interpolation branches to a third clock signal. The method also includes combining outputs of the first plurality of interpolation branches, the second plurality of interpolation branches, and the third plurality of interpolation branches to produce an output clock signal and adjusting a phase of the output clock signal by connecting an input of an interpolation branch of the third plurality of interpolation branches to the second clock signal.

Phase rotator

A printed circuit board ('PCB') including a substrate integrated waveguide ('SIW') formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.

PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication

Growing community of inventors

Georgetown, TX, United States of America

Daniel Mark Dreps