Intel Corporation

Daniel M Wong

John Heck

Valluri Ramana Rao

Qing Ma

Michele J Berry

Joseph S Hayden, Iii

Steve W Greathouse

A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality of caps is wafer bonded to a plurality of MEMS dice.

MEMS packaging using a non-silicon substrate for encapsulation and interconnection

A film bulk acoustic resonator wafer and microelectromechanical switch wafer may be combined together in face-to-face abutment with sealing material between the wafers to define individual modules. Electrical interconnects can be made between the switch and the film bulk acoustic resonator within a hermetically sealed chamber defined between the switch and the film bulk acoustic resonator.

Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator

A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

Growing community of inventors

Fremont, CA, United States of America

Daniel M Wong