Microelectronics and Computer Technology Corporation

Other

Daniel M Andrews

Michael A Olla

Thomas Alan Bishop

Gregory E Pitts

Michael J Bertram

Kenneth C Noddings

Alexander J Russo

Richard L Simmons

Philip J Spletter

Howard A Moore

David E Boone

A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

Fabrication of optical devices and assemblies

A testing and burn in socket compatible with the high density test pads located at small pitches devices on a TAB tape. A TAB tape carrier for supporting the TAB tape and a test circuit board having contact pads for electrical communication with the test pads. An alignment fixture positioned between the tape carrier and circuit board and including an opening in alignment between the test pads and the contact pads. A metal in elastomer matrix is positioned in the opening for providing electrical communication between the test pads and the contact pads. A block may be positoned in the openings and contain a plurality of straight parallel electrically conductive pins aligned with the matrix for high frequency tests.

Testing socket for tab tape

A desoldering material with an opening or window shaped so that the base of an electronic component can fit inside the opening while the desoldering material simultaneously contacts all solder joints which bond the component's outer leads to pads on a surface. A first adhesive secures the base to the surface, a second adhesive secures a retraction device to the base, the first adhesive is heated and softened without softening the second adhesive, and the retraction device removes the desoldered component from the surface. The invention is well suited to removing tape-automated-bonded integrated circuits adhesively attached to high density multichip module substrates.

Method and apparatus for using desoldering material

A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.

Apparatus for replacing defective electronic components

Method for replacing defective electronic components

A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.

Method and apparatus for removing solder mounted electronic components

Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which the inner ends of the leads are connected together. The outer ends of the leads are aligned with the electrical conductors and bonded thereto and the inner ends of the leads are disconnected from each other. An electronic component is bonded to a bottom cover, aligned in the opening, and the inner ends of the leads are bonded to the electrical component. The bottom and a top cover are sealably connected to the body enclosing the opening and the electronic component.

Hermetically sealed package having an electronic component and method of

A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

Laser Bonding apparatus and method

A single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds. A bonding tool has a tip with a multiple of nonparallel surfaces extending from the end of the tip for maximizing the amount of ultrasonic energy coupled to the electrical conductors. The surfaces may be recessed into the end of the tip or protrude outwardly from the end of the tip for coupling ultrasonic energy in directions both parallel and perpendicular to the conductors.

Growing community of inventors

Austin, TX, United States of America

Daniel M Andrews