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Nidec Corporation

Daniel L Thomas

John W Hoover

Charles R Marracino

A low profile fan body for cooling an electronic component has a fan frame supporting a fan, which is mounted on a fan base forming a heat sink or heat transfer body. The fan has plurality of fan blades received within a plenum chamber defined within the heat sink. Each fan blade defines a first axial edge, a second axial edge on a substantially opposite side of the blade relative to the first axial edge, and a radial edge extending between the first and second axial edges. The heat sink defines a base portion for engaging an exposed surface of the electronic component, and a plurality of heat fins spaced relative to each other along the periphery of the sink and defining the plenum chamber. A pressure differential surface is disposed between the radial edges of the fan blades and the fins for directing air flow in the axial direction of the fan. The radial edges of a plurality of the fan blades are at least partially exposed to the adjacent heat fins defining a flow path for cooling air across the radial edges exposed to the heat fins. The first axial edges of the fan blades are located adjacent to and spaced from the base portion of the heat sink, defining an additional flow path for cooling air between the first axial edges and the base portion.

Low profile fan body with heat transfer characteristics

An electronic component cooling low profile fan body with favorable heat transfer characteristics is disclosed. A fan, positioned in the body, includes a number of blades circumferentially formed around a central axis. The blades establish an axial blade depth region in reference to the central axis. The low profile fan body includes a frame supporting the fan. In one embodiment of the invention, the heat transfer body includes a pressure differential surface formed around the outer perimeter of the fan blades within a first segment of the axial blade depth region. An interface surface for connection to the electronic component is positioned opposite of the fan frame. A number of heat transfer devices are disposed between the frame and the interface surface, such that the heat transfer devices are positioned within a second segment of the axial blade depth region. In an alternate embodiment of the invention, heat transfer devices are disposed between the frame and the interface surface, without a pressure differential surface, along the entire axial blade depth region. The configuration of the heat transfer devices allows them to function as both a heat transfer surface and a pressure differential surface.

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San Jose, CA, United States of America

Daniel L Thomas