Chemcut Corporation

Other

Schering Aktiengesellschaft

Daniel L Goffredo

Conrad D Shakley

Joseph M Brady

Walter J Meyer

James J Ash

Franz R Cordes

Klaus H Gedrat

Conrad Dale Shakely

Horst Blaising

A process and apparatus is provided whereby metal is deposited onto articles such as plastics, ceramics and the like for producing printed circuit boards, metal plated ceramics, shielded articles and other plated articles, as part of a generally or substantially continuous process. Prior to plating, also as part of a continuous process while the boards are being generally continuously and horizontally conveyed in horizontal orientation, they are prepared to accept copper on their non-metallic portions, by application of a chemical reducing solution thereto, preferably after previously having been provided with a chemical activation solution thereto. Then the boards are transferred to a vertical orientation and conveyed in vertical orientation through an electroless copper deposition bath, at a reduced rate of travel, during with a copper solution adheres to the thus treated non-metallic portions of the boards, and to the metallic portions of the boards as well. After the plating process is completed in the bath, the boards are preferably retransferred to generally horizontal orientation and conveyed through appropriate completion steps, such as cleaners, rinsers, anti-tarnish steps, dryer steps and the like, with preferably uniform thin copper coatings thereon, and thereafter the boards are subsequently plated with a thicker copper coating, preferably by means of an electroplating process.

Process and apparatus for plating onto articles

An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces. Solution flow through the electrolyte path is provided on a continuous basis, and both agitates and replenishes the electrolyte solution. Dams are created at ends of the flow path, by the action of squeezing rollers, to prevent passage of electrolyte. Wipers are provided for preventing the turbulence of newly-delivered electrolyte in the bath zone from immediately contacting the contact wheels. Other features are also provided.

Electroplating apparatus and method

Printed circuit boards are carried generally vertically, along a path, with the tabs at the lower end being immersed in an electrolyte. The boards are automatically conveyed through opposed serially arranged pairs of rollers, which drive them along their path. Brushes wipe the boards to prevent contact with electrolyte above the desired contact level, as they are conveyed along the path. The solution is constantly replenished and turbulence provided by delivering electrolyte solution, with insoluble metallic ions in it, by pumping the solution from a sump, through an array of nozzles along each side of the path, thus providing fresh electrolyte along with providing turbulence to the electrolyte. The nozzles are charged at a sufficiently low level to avoid their destruction. Electrical contact is made with the printed circuit boards, by means of serially engaging the boards with spring fingers of a continuous conductor along each side of the boards as they are conveyed along their path, and thereby conducting the applied charge to the immersed tabs, whereby the tabs function as cathodes for electrodeposition of metallic ions thereon. The drive for the boards is provided by means of opposed pairs of rollers. One roller in each pair is a driving roller, with the opposing roller functioning as an idler, but forming an interference fit between the rollers as the boards are carried therebetween.

Apparatus and method of treating tabs of printed circuit boards and the

An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces. Solution flow through the electrolyte bath is provided on a continuous basis, and both agitates and replenishes the electrolyte solution. Dams are created at ends of the flow path, by the action of squeezing rollers, to prevent passage of electrolyte. Wipers are provided for preventing the turbulence of newly-delivered electrolyte in the bath zone from immediately contacting the contact wheels. Other features are also provided.

A system is provided for control of ion concentration (as for example in pH or redox control), for use for example in etching articles, wherein other features such as specific gravity control are also provided. The ion concentration control is provided with cleaning and recalibration features. In a specific embodiment, provision is made for adding ammonia to an etching solution and for continuously monitoring the pH of the system. Visual indicators are provided for operator observation of fluid flow through various lines, generally by windows being provided in the cabinet apparatus. A particular electrode cell is disclosed as a prominent feature of ion concentration control.

Method for ion control of solutions

Apparatus for ion control of solutions

Modular chemical treatment apparatus with improved sidewall connecting and alignment means consisting of a connecting member secured to abutting sidewalls, the connecting member overlying and held in intimate contact with a longitudinal, vertical planar surfce. A variety of such connecting and alignment means are disclosed.

Connecting and alignment means for modular chemical treatment system

Apparatus is provided for drying articles that have been treated, for example, with an etchant or other treatment fluid and then washed, in order to remove the liquid, generally water, therefrom, the apparatus employing a conveyor for conveying the articles through a chamber, with a plurality of gas knives for preferably engaging the wet articles with a stream or curtain of cool air for physically impelling most of the liquid, generally water, from the articles, followed by delivering the articles past one or more other gas knife stations whereby air that has been heated is impelled onto the articles, for removing generally water film from the surface thereof. The apparatus is adjustable for using a single blower to provide originally unheated air to a single duct that is bifurcated into two channels, with a heater being provided in one of the channels.

Drying apparatus

An etching system is disclosed, whereby individual and discrete modules are provided, each for performing its own function, with the modules being longitudinally connected in serial arrangement, and being aligned by suitable pin-in-hole arrangement, and with a common drive for all of the modules, by the use of drive rods carried by each of the modules that are coupled together with the connecton of adjacent modules. Individual features of the various drive means are also disclosed.

Connecting modules for an etching system

Treated articles such as printed circuit boards that have been etched with an etchant or treated with a solvent, are delivered into a zone of sufficiently high humidity to prevent drying of a liquid treatment fluid on the articles, and wherein the treatment fluid is 'blown off' the articles by pressurized air, in the high humidity environment, with the treatment fluid then being delivered for re-use at a prior station. Alternately, the treatment fluid is atomized, entrained in the pressurized air stream and 'blown on' the articles, whereby the treatment fluid is efficiently and uniformly applied thereto.

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Riverton, NJ, United States of America

Daniel L Goffredo