Siemens Aktiengesellschaft

Daniel Kappauf

Bernd Kürten

Lutz Namyslo

Jens Schmenger

Stanislav Panicerski

A housing part for accommodating a semiconductor element includes a pin partially molded in the housing part for electrical connection to a printed circuit board. The pin includes a bonding surface for producing an electrical connection between the pin and the semiconductor element. The housing part includes a bearing surface for the bonding surface and a recess formed in the bearing surface or adjoining the bearing surface. A vibration-damping material is at least partially filled in the recess and/or applied in a region adjoining the recess. The housing part is designed as a one-piece housing frame part.

Semiconductor component with damped bonding surfaces in a package with encapsulated pins

In a method of manufacturing a power module unit, cooling fins are positioned in recesses of a frame, in particular a metal frame. A first metallic material is applied to the cooling fins and the frame by a thermal spraying process, causing the applied first metallic material to produce a material bond between the cooling fins and the frame.

Method for manufacturing a power module unit

A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.

Growing community of inventors

Gräfenberg, Germany

Daniel Kappauf