Lenovo (singapore) Pte. Ltd.

Daniel Justin Hebel

Philip John Jakes

David Rivera

Peter Hamilton Wetsel

Joseph Nicholas Laltrello

James Stephen Rutledge

Clifford Allen Gaw

Brinda Kumar Ramaiya

In one aspect, a device includes a processor and a memory accessible to the processor. The memory bears instructions executable by the processor to receive at least a first Bluetooth low energy (BLE) signal from a BLE beacon and enable a first function of the first device at least in part in based on receipt of the first BLE signal.

Providing access to and enabling functionality of first device based on communication with second device

Heat from the core of a semiconductor chip package mounted on a printed circuit board assembled into a computer system is dissipated to both sides of the printed circuit board. A pair of integrated heat spreaders are disposed at opposite sides of the core, and two heat sinks are positioned at opposite sides of the package. Each of the heat sinks is positioned in thermal communication with one of the heat spreaders to dissipated heat from the core.

Integrated circuit chip thermal solution

Growing community of inventors

Raleigh, NC, United States of America

Daniel Justin Hebel