Motorola Corporation

Nxp Usa, Inc.

Daniel Joseph Viza

David Paul Lester

Dennis Brian Miller

Lionel Mongin

James Eric Scott

William M Beckenbaugh

Kent W Hansen

Barry Boaz Groman

Justin H Smart

Conrad S Monroe

Christopher M Kerlin

Mark William McGarry

Charles Di Ruzzio

Douglas Bruce Feicht

Ellen Margaret Reid

A system is configured to perform an operation that results in increasing a thermal energy of a load. The system includes a radio frequency signal source configured to supply a radio frequency signal, an electrode coupled to the radio frequency signal source, and a variable impedance network that includes at least one variable passive component. The variable impedance network is coupled between the radio frequency signal source and the electrode. The system includes a controller configured to determine an operation duration based upon a configuration of the variable impedance network, and to cause the radio frequency signal source to supply the radio frequency signal for the operation duration.

Method for performing a defrosting operation using a defrosting apparatus

A radio-frequency (RF) heating system may include a removable drawer, which may be inserted under a fixed shelf of the RF heating system to form an enclosed cavity. The drawer may include conductive channels or side rails that may interface with the shelf of the defrosting system in order to electrically couple the drawer to the RF heating system. The drawer may include an electrode that is electrically coupled to ground or to a RF signal source when the drawer is inserted beneath the shelf. The shelf may include selectable electrodes of varying sizes. The RF heating system may use identification circuitry to recognize the type of drawer that has been inserted beneath the shelf. RF energy may be applied to the electrode of the drawer or the shelf to heat a load in the enclosed cavity.

Drawer apparatus for radio frequency heating and defrosting

A component alignment and transfer apparatus is disclosed which includes an accumulator for accumulating and aligning a plurality of components and a transfer head for transferring the accumulated and aligned components from the accumulator to a collection receptacle. The transfer head includes a scissor mechanism having a plurality of sections, with each section including a pair of scissor arms intersecting at a pivot point and a suction pickup. The plurality of sections are pivotally connected to form an elongated transfer head movable between a first position having a first spacing between suction pickups and a second position having a second spacing between suction pickups. An actuator is connected to move the suction pickups between the first position and the second position.

Component alignment and transfer apparatus

A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20). The preassembly (38) is then heated to bond the bonding agent (14) to the metal contact (24) and to cure the film (18) to form an integral assembly (10).

Method for forming a microelectronic assembly

A vacuum pickup tool (10) is effective to carry balls (18) arranged in a desired pattern. The vacuum pickup tool (10) includes a manifold (12) that includes a carrier plate (22) that has a plurality of manifold bores (28) arranged in a pattern. The manifold (12) defines a vacuum chamber (20) that reduces gas pressure in the manifold (12) to allow the manifold bores (28) to retain a ball (18). The manifold (12) further includes a retaining plate (14) that overlies the carrier plate (22) and includes a plurality of retaining plate bores (30) arranged in a pattern such that each retaining plate bore (30) registers with a corresponding manifold bore (28). The retaining plate (14) is effective to secure a stencil (16) formed of a gas-impermeable sheet against the carrier plate (22) to prevent gas flow between a manifold bore (28) and a corresponding retaining plate bore (30).

Vacuum pickup tool for placing balls in a customized pattern

A method of mounting an integrated circuit carrier (10) having a plurality of straight leads (12) retained by an integral frame (16) is provided. The plurality of straight leads (12) of the carrier (10) is bent to form a plurality of bent leads (12) still retained by the frame (16). The plurality of bent leads are then scored to form a notch (32) on each bent lead. Solder fluxing, placing, and reflowing the plurality of bent leads of the integrated circuit carrier against corresponding printed lines of the printed circuit (26) surface before each notch follow. Finally, a remainder portion of the plurality of leads from and including the frame (16) to the notch (32) on each lead (12) is removed.

Growing community of inventors

Phoenix, AZ, United States of America

Daniel Joseph Viza