Motorola Corporation

Daniel J Wallace, Jr

Clem H Brown

Mario F Velez

A differential pressure sensor (10) has a sensor die (16) attached to a stress isolation package base (12) with a bonding glass (27) having a similar coefficient of thermal expansion. The bonding glass, and alternately an aluminum layer, provides a hermetic seal between the stress isolation base and sensor die. Pressure is applied to the sensor die port (24). A plastic housing (14) is attached to the stress isolation base with an adhesive (29). A port (23) in the plastic housing is filled with a silicone gel (22). A second pressure source is transferred by way of the silicone gel to the sensor die. Any hostile chemical entering the via contacts the first surface of the sensor die to assert pressure against a transducer circuit (25) to generate the electrical signals representative of the applied pressure but are isolated from the sensitive interconnects by the hermetic seal.

Hermetically sealed pressure sensor and method thereof

A dual absolute pressure sensor independently converts first and second external pressures to first and second electrical signals respectively. A package body has first and second openings for receiving the first and second external pressures to outside surfaces of first and second sensor die attached to opposite surfaces of an internal glass substrate that separates the first and second openings. The first sensor die includes a first cavity having a reference pressure to measure against the first external pressure and develop a first differential pressure. A first piezoelectric network converts the first differential pressure to the first electrical signal representative of that pressure. The second sensor die includes a second cavity having a reference pressure to independently measure against the second external pressure and develop a second differential pressure. A second piezoelectric network converts the second differential pressure to the second electrical signal representative of that pressure.

Growing community of inventors

Phoenix, AZ, United States of America

Daniel J Wallace, Jr