3M Innovative Properties Company

Solventum Intellectual Properties Company

Daniel J Theis

Mikhail L Pekurovsky

Matthew S Stay

Ann M Gilman

Shawn C Dodds

Brian Kenneth Nelson

Daniel H Carlson

Matthew R D Smith

Tri Dinh Pham

Thomas J Metzler

Jeffrey H Tokie

Qingbing Wang

Michael Albert Haase

Encai Hao

James N Dobbs

Roger W Barton

Kara A Meyers

Ronald P Swanson

John Allen Wheatley

Duane Douglas Fansler

Douglas Scott Dunn

Donald George Peterson

John T Strand

Kui Chen-Ho

Nicholas T Gabriel

G Marco Bommarito

Kevin W Gotrik

Karl K Stensvad

Wensheng Xia

Susannah C Clear

Scott J Jones

Jonathan J O'Hare

Saagar A Shah

Jeremy K Larsen

Anthony F Schultz

Keith R Bruesewitz

Ankit Mahajan

Kayla C Niccum

Randy S Bay

David L Hofeldt

Jonah Shaver

James Zhu

Lyudmila A Pekurovsky

David D Miller

Tien Yi T H Whiting

Levent Biyikli

Daniel P Meehan

Bryan T Whiting

Jonathan W Kemling

Teresa M Goeddel

Samuel Kidane

Kim B Saulsbury

Larry D Humlicek

Shu-Ching Fan

Grant F Tiefenbruck

Taylor J Kobe

Ilyess H Romdhane

Steven J Botzet

Naiyong Jing

Jessica Chiu

Joseph E Hernandez

Matthew R Smith

Benjamin J Münstermann

Bradley S English

Matthew RD Smith

Ann Marie Gilman

Jonathan J O'HARE

Aspects of the present disclosure relate to a sensor device having an integrated circuit and a monitoring loop coupled to the integrated circuit. The monitoring loop includes a first conductive trace and a second conductive trace, each having a first end electrically coupled to the integrated circuit and a second end. The monitoring loop includes a sterilant-responsive switch electrically coupling the second ends of the first conductive trace and the second conductive trace. The sterilant-responsive switch has a first impedance state and a second impedance state. The sterilant-responsive switch modifies an electrical connection between the first conductive trace and the second conductive trace based on exposure to an adequate environmental condition in an adequate sterilization process. The sensor device also includes an antenna coupled to the integrated circuit forming an antenna loop that is distinct from the monitoring loop.

Sterilization indicator sensor with a sterilant-responsive switch

The disclosed patterned wavelength-selective material and process for making the patterned wavelength-selective material uses patterned applied adhesive and a structurally weak wavelength-selective material that includes portions that contact the adhesive and break to remain in contact with the adhesive. In one embodiment, the wavelength-selective material comprises an array of sections with cuts at least partially through a wavelength-selective film at each section secured to the adhesive. In another embodiment, the wavelength-selective film comprises a transfer stack of layers.

Patterned wavelength-selective film

An optical film having a first surface, an opposing second surface, and a thickness normal to the first and second surfaces is cut. Cutting the film forms a channel at least partially through the thickness of the film. A light control material is printed proximate to a surface of the film. The ink traverses through the channel by capillary motion.

Optical film with light control edge

A unitary optical film stack comprising a light redirecting film assembly; a light diffusion film assembly; and an optical adhesive; wherein the light redirecting film assembly and the light diffusion film assembly are physically coupled non-continuously to minimize optical coupling.

Unitary optical film assembly

A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

Electronic devices comprising a via and methods of forming such electronic devices

Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.

Methods of passivating adhesives

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

Automatic registration between circuit dies and interconnects

An optical film assembly comprising a first optical film, a coupling member, and a second optical film wherein the first optical film comprises a prismatic film, the second optical film comprises a diffuser, wherein the coupling member is bonded to the first optical film and to the second optical film such that the first optical film and second optical film are physically coupled, and the coupling member is bonded to at least one of the first optical film and the second optical film non-continuously such that an optically effective air gap is provided. Also, a method for making such optical film assemblies.

Optical diffusing film laminate and method of making

A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

Patterned overcoat layer

A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.

Protective coating for printed conductive pattern on patterned nanowire transparent conductors

A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.

Bonding electronic components to patterned nanowire transparent conductors

An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.

Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Methods of achieving precision registration in a roll to roll process for making patterned substrates by depositing first and second inks in a predetermined pattern, the predetermined pattern having fiducial marks and main pattern marks. One of these inks prints the fiducial marks onto a substrate while another ink prints main pattern marks on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks. Touch screen displays including patterned substrates prepared of the methods are also disclosed.

Printing of multiple inks to achieve precision registration during subsequent processing

A method of achieving precision registration in a roll to roll process by simultaneously depositing multiple inks onto a printing roll. One of these inks prints a pattern of fiducial marks onto a substrate while another ink prints a predetermined pattern on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks.

A system for making flexible circuit films includes an inelastic conveyor, a web handling apparatus configured to pass a flexible substrate around the inelastic conveyor, an image acquisition apparatus configured to measure positions of a first set of alignment marks on the flexible substrate at a first conveyor location, an exposure apparatus configured to patternwise expose a photosensitive material on the flexible substrate at a second conveyor location, and an image processor configured to receive the measured positions of the first set of alignment marks, and to compare the measured positions with reference positions of the first set of alignment marks. The exposure apparatus is configured to patternwise expose the photosensitive material based on the comparison between the measured positions and the reference positions.

Roll-to-roll digital photolithography

Growing community of inventors

Mahtomedi, MN, United States of America

Daniel J Theis