Mayo Foundation for Medical Education and Research

Daniel J Schwab

Barry K Gilbert

Clifton R Haider

Gary Scott Delp

Christopher L Felton

Patrick Joseph Zabinski

Nathan E Harff

Mark E Vickberg

Spectrophotometer system configured to characterize and/or measure spectrally (wavelength)-dependent properties of material components (such as molecular, viral, and/or bacterial analytes) associated with or of an object prior to the time when optical fingerprints of such material components start to degrade, and associated methods. System can be enhanced by a capability of selecting specific wavelengths of operation for such system to optimize cost-efficiency of the system.

Spectrophotometer system and enhanced optical characterization of biological samples using same

A fall detection system includes a plurality of sensors in which at least one of the sensors is coupled to or disposed near a floor. The fall detection system further includes a central monitoring system in signal communication with the plurality of sensors. The central monitoring system is configured to receive a response signal in response to an activation signal being transmitted from at least one of the plurality of sensors, and determine whether the response signal is indicative of a person being arranged in a prone position on the floor.

Proximity based fall and distress detection systems and methods

A monitor of a physiological parameter of subject under test to which the monitor is attached, in operation. The monitor includes a set of accelerometers operating in different ranges of acceleration and a physiological sensor. The physiological sensor may include an ECG circuit producing an output data characterizing the subject as a function of a degree of motion and/or reorientation of the monitor or an oximeter device. The process of monitoring includes a determination of R-wave of the subject.

Low-power, compact, resilient system and method for physiological monitoring

A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41). In yet another embodiment, a carrier apparatus (100) for mounting logic components on the surface of a circuit board (41) is disclosed which utilize ground and voltage planes together with alternating signal (118) and AC ground (121) traces so as to effectuate coplanar/strip-line and coplanar/microstrip transmission line environments along portions of the signal traces (118). Consequently, this results in signal lines having a controlled impedance environment and minimized crosstalk between neighboring signal leads lying in the same plane.

Leadless chip carrier apparatus providing an improved transmission line

A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41). In yet another embodiment, a carrier apparatus (100) for mounting logic components on the surface of a circuit board (41) is disclosed which utilize ground and voltage planes together with alternating signal (118) and AC ground (121) traces so as to effectuate coplanar/strip-line and coplanar/microstrip transmission line environments along portions of the signal traces (118). Consequently, this results in signal lines having a controlled impedance environment and minimized parasitic shunt capacitance.

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Mantorville, MN, United States of America

Daniel J Schwab