Freescale Semiconductor,inc.

Daniel J O'Hare

Anthony G Dunne

James W Miller

Michael A Stockinger

Matthew Richard Miller

Omid Oliaei

Alex P Gerdemann

Alan Bannon

Jeannie Han Millaway

Paul J Sheridan

Embodiments of the present disclosure provide an integrated circuit (IC) or semiconductor device. This semiconductor device includes a number of I/O pads or bumps on an outer surface of the semiconductor device, a number of electrostatic discharge (ESD) protection cells and functional modules. Individual ESD protection cells couple to and are downstream of individual I/O pads. Functional modules coupled to and are downstream of individual ESD protection cells. The ESD protection cells protect circuitry within the functional module from electrostatic discharge events. A rail clamp may provide an ESD discharge path between a first power supply bus and a second power supply bus. The ESD protection cells may be collected in groups to form clusters (with linear or irregular placement patterns). These clusters may be distributed autarchically across the semiconductor device overlapping one or more functional modules or within spaces or gaps between the functional modules.

Distribution of electrostatic discharge (ESD) circuitry within an integrated circuit

An analogue-to-digital converter apparatus comprises a first integrator coupled to a second integrator. The first and second integrators are coupled so as to provide a complex pole. The first integrator is selectively electrically decoupleable from the second integrator, thereby removing the complex pole.

Analogue-to-digital converter apparatus and method of reusing an analogue-to-digital converter circuit

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Turners Cross, Ireland

Daniel J O'Hare