Hewlett-packard Company

Agilent Technologies, Inc.

Other

Avago Technologies Wireless IP (singapore) Pte. Ltd.

Daniel J Miller

Kim Hong Chen

Jacques Leibovitz

Voddarahalli K Nagesh

Giles Humpston

Gary Richard Trott

Lewis R Dove

Yoshikatsu Ichimura

Michael James Nystrom

Robert Keith Crawford

Clinton C Chao

Jeffrey G Hargis

Robert A Schuchard

Nancy M Mar

V K Nagesh

Maria L Cobarruviaz

Heidi Linch Reynolds

Martha Johnson

John P Scalia

Howard H Nakano

Vaddoarahalli K Nagesh

Hubert A VanderPlas

An acoustic resonator, comprises a substrate and a first passivation layer disposed over the substrate. The first passivation layer comprises a first layer of silicon carbide (SiC). The acoustic resonator further comprises a first electrode disposed over the passivation layer, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator comprises a second passivation layer disposed over the second electrode. The second passivation layer comprises a second layer of silicon carbide (SiC).

Passivation layers in acoustic resonators

A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 &#x3bc;m and preferably about 5 &#x3bc;m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

Compliant and hermetic solder seal

Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.

Vented cavity, hermetic solder seal

A multilayer ceramic device has top and bottom green ceramic layers machined and fired. Intermediate green ceramic layers are machined, have conductors laid down in the machined areas, are laminated, and are fired to form an enclosure layer. The areas of the layers which will be in contact with each other are coated with a bonding agent. The layers are aligned and bonded to form a structure having arbitrarily shaped, interior channels adjacent to the top and bottom layers which are not subject to detrimental nonplanarities.

Planar multilayer ceramic structures with near surface channels

A method and apparatus is presented for designing an RF modular hybrid circuit assembly. The apparatus comprises a rule-based control mechanism, a graphical user interface and a library of RF hybrid elements including model front- and back-sides, and input/output instances. The method comprises the steps of initializing standardized front- and back-plane models, adding input/output instances along the perimeter of the back-plane, designing the hybrid circuit on the front-plane and combining the two planes to arrive at an RF modular hybrid layout design. A data library of RF hybrid elements is provided to facilitate rapid prototyping. The final design is then sent concurrently to a photo-plotter and a laser subsystem for printing the thick-film and cutting the PTHs respectively.

Method and apparatus for computer-aided design of different-sized RF

A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized conducting elements and customizable transitions and circuit regions. The customizable transitions can be placed anywhere along the conducting element and are capable of low and high frequency performance. Attachment of the assembly can be effected via a standardized clamping structure which compresses an elastomeric member upon the conducting elements or by bending the conducting elements and soldering on end to attachment sites on the motherboard. Each member of the family of modular hybrid assemblies provides a controlled impedance transition from a transmission line on the circuit assembly to a transmission line on the motherboard.

Family of different-sized demountable hybrid assemblies with

A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.

Composite transversely plastic interconnect for microchip carrier

A specialized etching method for producing fine-geometry gold circuit structures. Production thereof is accomplished by maintaining a constant gold etching rate. Metal etching normally slows as the amount of dissolved gold (a reaction product of the etching process) increases. To remove the dissolved gold, one method involves cooling the etchant to precipitate a gold complex therefrom. The remaining, recovered etchant is then heated and made available for continued etching. Another method involves a cathode/anode assembly which is immersed in the etchant. Activation of the assembly recovers metallic gold and regenerates the etchant. These methods, when used continuously or periodically in a dip or spray etching system, maintain a constant etching rate. As a result, fine-geometry circuit structures may be accurately produced while minimizing material costs (e.g. etchant use) and minimizing the production of undesirable waste products and disposal expenses associated therewith.

Controlled etching process for forming fine-geometry circuit lines on a

Method and apparatus for controlling the temperature of one or more electrical component chips positioned on a face of a substrate and for providing component-to-component electrical interconnect traces between the chips. One or a selected set of electrical interconnections, contained within the substrate and connected to a chip, is also connected to a column of high electrical and thermal conductivity material within the substrate that is in direct thermal contact with the working fluid in a heat pipe. The heat pipe is sealed and is contained in the substrate interior and is in electrical and thermal contact with the electronic components on a chip. The heat pipe working fluid receives heat from the electronic components through the thermally conducting column, changes phase through absorption of this heat, and transports the heat to heat dissipation means located elsewhere.

Heat pipe-electrical interconnect integration method for chip modules

Heat pipe-electrical interconnect integration for chip modules

A method for producing insulated superconductor wire including the steps of a tubular glass preform, filling it with a superconductor material, suspending the preform within an oven to heat a section of the preform to approximately its softening point, and drawing the softened preform into a superconductor wire. A plastic coating can be applied to the wire to increase its durability. The completed wire preferably includes a superconductor core having its superconductor phase aligned with the longitudinal axis of the wire, a glass coating over the superconductor core, and a plastic coating over the glass coating.

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San Francisco, CA, United States of America

Daniel J Miller