Motorola Corporation

Medtronic, Inc.

Daniel J Koch

Rajesh V Iyer

Simon E Goldman

Susan A Tettemer

Curtis E Burgardt

Ryan J Jensen

Daniel N Koury, Jr

William John Taylor

Shawn D Knowles

Jonathan H Hammond

Kenneth G Goldman

Gregory John Haubrich

Bishnu Prasanna Gogoi

Joseph F Lessar

Mark D Breyen

Mark D Summers

Joyce Yamamoto

Raymond Mervin Roop

Ronald J Gutteridge

David Nghiem

Len D Twetan

Keith G Kamekona

Paul L Bergstrom

Jonathan F Gorrell

Michael E Nowak

Kathirgamasundaram Sooriakumar

Roger L Hubing

An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.

Electrical interconnection structures and method

An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.

Method and apparatus for minimizing EMI coupling in a feedthrough array having at least one unfiltered feedthrough

A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.

Determination of equivalent series resistance

A feedthrough assembly for guiding a plurality of terminal pins through the housing of an implantable medical device. The feedthrough assembly comprises a ferrule fixedly coupled to the housing and having an aperture therethrough, and a non-conductive supporting structure fixedly coupled to the plurality of terminal pins and disposed within the aperture. The supporting structure is configured to guide the plurality of terminal pins through the ferrule. A plurality of capacitors, which is fewer in number than the plurality of terminal pins, is fixedly coupled to the supporting structure and electrically coupled between the ferrule and selected ones of the plurality of terminal pins.

Multipolar feedthrough assembly with customizable filter and method of manufacture

An electronic component includes a composite semiconductor substrate ( ) having a first side ( ) opposite a second side ( ), a semiconductor device ( ) at the first side of the composite semiconductor substrate, and a transducer ( ) at the second side of the composite semiconductor substrate.

Electronic component

A capacitively sensed micromachined component includes an electrically insulative substrate ( ) having a first side ( ) and a second side ( ) opposite the first side. The component also includes a first layer ( ) adjacent to the second side of the electrically insulative substrate where at least a first portion of the first layer located adjacent to the second side of the electrically insulative substrate is infra-red light absorbing and is also electrically conductive. The component further includes a diffusion and chemical barrier layer ( ) encapsulating the first layer and the electrically insulative substrate. The component still further includes a capacitively sensed micromachined device ( ) on the diffusion and chemical barrier layer.

Capacitively sensed micromachined component and method of manufacturing

A sensor has a support substrate (,), an electrode (,) movable relative to a surface (,) of the support substrate (,) and comprised of a first material, a structure (,) over a portion of the electrode (,) to limit mobility of the electrode (,) and comprised of a second material different from the first material, and bonding pads (,) outside a perimeter of the electrode (,) and comprised of the second material.

Method of manufacturing a sensor

A sealable air gap (14) is formed between a heating element (16) and a base (11) to improve the thermal isolation of a semiconductor heater (10). A top layer (17) is formed over the heating element (16) which seals the air gap (14) so that the sealable air gap (14) can be at either atmospheric pressure or under a vacuum. The semiconductor heater (10) can be used in a variety of applications including as a heat source to adjust the resistivity of an overlying resistive layer (18). The embodiments of the semiconductor heater (10) also include a chemical sensor (20). Heat from a heating element (26) is used to keep an overlying layer of chemical sensing material (28) at an optimal temperature. The embodiments of the present invention also include a transducer (40) to heat a fluid (52) in a well (55) such as in an ink jet application.

Semiconductor heater and method for making

A sensor (11) has a movable plate (16) that moves in response to an external acceleration. The movable plate (16) has a finger (17) that is capacitively coupled to fingers (13,14) that are attached to a substrate (12). A travel stop (19) is used to stop the movable plate (16) before the finger (17) on the movable plate (16) collides into the fingers (13,14) on the substrate (12).

Sensor devices having a movable structure

A capacitive microphone (10) utilizes a polysilicon diaphragm (14) that overlies an atmospheric cavity (34). The diaphragm is doped and annealed to form a sensitivity of the microphone (10). A silicon cap covers and protects the diaphragm (14) and a fixed plate (18).

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Lakeville, MN, United States of America

Daniel J Koch