Hughes Electronics Corporation

Hrl Laboratories, LLC

Rosemount Aerospace Limited

Daniel J Hyman

Robert Y Loo

Adele E Schmitz

Tsung-Yuan Hsu

Julia J Brown

Juan F Lam

Brett Warneke

James H Schaffner

Jonathan James Lynch

Debabani Choudhury

Lap-Wai Chow

Paul Ouyang

James A Foschaar

Robert N Schwartz

Jar Jar Lee

Mehran Mehregany

Stan W Livingston

Darren E Atkinson

Jae Lee

A microelectromechanical (MEM) switch is fabricated inexpensively by using processing steps which are standard for fabricating multiple metal layer integrated circuits, such as CMOS. The exact steps may be adjusted to be compatible with the process of a particular foundry, resulting in a device which is both low cost and readily integrable with other circuits. The processing steps include making contacts for the MEM switch from metal plugs which are ordinarily used as vias to connect metal layers which are separated by a dielectric layer. Such contact vias are formed on either side of a sacrificial metallization area, and then the interconnect metallization is removed from between the contact vias, leaving them separated. Dielectric surrounding the contacts is etched back so that they protrude toward each other. Thus, when the contacts are moved toward each other by actuating the MEM switch, they connect firmly without obstruction. Tungsten is typically used to form vias in CMOS processes, and it makes an excellent contact material, but other via metals may also be employed as contacts. Interconnect metallization may be employed for other structural and interconnect needs of the MEM switch, and is preferably standard for the foundry and process used. Various metals and dielectric materials may be used to create the switches, but in a preferred embodiment the interconnect metal layers are aluminum and the dielectric material is SiO , materials which are fully compatible with standard four-layer CMOS fabrication processes.

CMOS-compatible MEM switches and method of making

Methods for the design and fabrication of micro-electro-mechanical switches are disclosed. Two different switch designs with three different switch fabrication techniques are presented for a total of six switch structures. Each switch has a multiple-layer armature with a suspended biasing electrode and a conducting transmission line affixed to the structural layer of the armature. A conducting dimple is connected to the conducting line to provide a reliable region of contact for the switch. The switch is fabricated using silicon nitride as the armature structural layer and silicon dioxide as the sacrificial layer supporting the armature during fabrication. Hydrofluoric acid is used to remove the silicon dioxide layer with post-processing in a critical point dryer to increase yield.

Fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications

A multiband millimeterwave antenna system for communicating signals in multiple frequency bands is disclosed. A main antenna body is connected to antenna extensions by micro-electro-mechanical switches. By opening and closing the switches, the length of the antenna can be altered. The antenna is coupled to a microstrip feed line by an aperture. A series of matching stubs match the impedance of the feed line for the various signal frequencies.

Multiband millimeterwave reconfigurable antenna using RF mem switches

Design and fabrication of broadband surface-micromachined

A reconfigurable filter system designed using micro-elecro-mechanical (MEM) switches is disclosed. The filter comprises a transmission line with one or more filter stubs coupled to the transmission line by MEM switches. The impedance of the filter system is altered by selectively opening and closing the MEM switches, which alters the filter characteristics of the filter system. Alternatively, the characteristics of the filter system are altered by using the MEM switches to selectively alter the length of filter stubs attached to the transmission line.

Reconfigurable millimeterwave filter using stubs and stub extensions

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Cleveland, OH, United States of America

Daniel J Hyman