Technic, Inc.

Future Automation, Inc.

Daniel J Gramarossa

Gary C Downes

Robert Kaufman

Heinz W Schlenker

Louis J Hirbour

Frank J Johnson

Earl G Baer

A method of processing a wafer or other articles by horizontally transporting vertically oriented wafers into one or more process cells. A carrier is rotated from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

Method of processing and plating planar articles

A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the process cell, and then transporting the carrier out of the process cell horizontally through an outlet opening of the process cell. In one exemplary implementation, the process performed within the cell is a pre-or post- treatment where the wafer is subjected to an acid solution treatment and/or a rinsing with de-ionized water treatment. In another exemplary implementation, the process performed within the process cell is an electroplating of the plating surface of the wafer. Additionally, a method of processing an empty carrier entailing transporting the carrier horizontally through an inlet opening of a process cell, processing the carrier within the process cell, and transporting the carrier out of the process cell horizontally through an outlet opening.

Method of processing wafers and other planar articles within a processing cell

A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate. With regard to improving the uniformity of the plating deposition, the plating apparatus and method effectuate random horizontal fluid flow within the bath to reduce the occurrence of relatively long horizontal fluid flow that causes non-uniform plating deposition across the surface of the wafer.

Apparatus and method for plating wafers, substrates and other articles

Apparatus and method for electroplating wafers, substrates and other articles

A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate. With regard to improving the uniformity of the plating deposition, the plating apparatus and method effectuate random horizontal fluid flow within the bath to reduce the occurrence of relatively long horizontal fluid flow that causes non-uniform plating deposition across the surface of the wafer. In addition, the plating apparatus and method configure the electrostatic field between the anode and cathode in a manner that improves the uniformity of the current distribution across the surface of the wafer to provide a more uniform plating of the wafer. Also, a secondary cathode is provide between the anode and cathode to alter the electrostatic field in order to improve the uniformity of the plating deposition across the surface of the wafer. With regard to minimizing damage to the wafer, the plating apparatus and method provides a conductive liquid to effectuate the cathode contact to the surface of the wafer.

Disclosed is an in-line electrolytic deflash system and method for removing resin bleed and other materials from the leads of an encapsulated electronic component. An encapsulated electronic component is carried on a continuous belt through the system. The component first passes through an electrolytic deflash station which includes tanks filled with a deflash solution for loosening the resin bleed. The component is then rinsed in a low pressure rinse station, and then carried through a high pressure rinse station where the loosened resin bleed is removed from the component. The component is then further rinsed with both tap water and a deionized water. Once the component has been sufficiently rinsed any remaining moisture is blown off the part in an air knife station and the component is then passed through a dryer which completely removes any moisture remaining on the component.

Method and system for removing resin bleed from electronic components

Improved apparatus for carrying encapsulated electronic components, having a conveyor belt defined by a horizontal web with a pluraity of identical, flexible tines depending from both sides of the edge of the web. The web is formed into a continuous, endless loop adapted to be carried on a pair of vertical pulleys rotatable on horizontal shafts. Projecting cams, on the face of the web of the belt remote from the dependent tines, engage mating indentations in the periphery of the two pulleys guiding and imparting movement to the belt. The opposing groups of tines are urged apart, by spreader cams, at the beginning and end of the passage of the belt between the lower faces of the two pulleys. Parts to be plated are brought into the space between the tines which, upon exiting from the cams as the conveyor moves entrap the part between them and causing them to move through the plating tanks and treatment stations positioned along the path of the conveyor. The conveyor belt releases the plated and treated parts, upon the separation of the tines, allowing the parts to drop into receiving containers. The conveyor belt is a conductive material and is utilized as the cathode of the plating system.

Apparatus for carrying encapsulated electronic components through

An improved transport belt is provided for gripping and carrying parts such as thin and fragile electronic components through production processes including, for example, electroplating steps and the like. The transport belt comprises an elongated upright web carrying a succession of depending gripper units, each including first and second fingers for gripping and carrying the production parts. The first finger is formed generally coplanar with the belt web, whereas the second finger has a generally U-shaped configuration with depending legs on the leading and trailing sides, respectively, of the first finger. The legs are deformed laterally from the plane of the belt web and interconnected at their lower ends by a cross bar which is urged by the legs into spring-loaded contact with the lower end or tip of the first finger. The fingers are separable at a loading station to permit insertion of a thin and/or fragile production part which is gripped, upon closure of the fingers, with directly opposed forces thereby avoiding part distortion as it is carried through production processes.

Growing community of inventors

Moorpark, CA, United States of America

Daniel J Gramarossa