E.i. Dupont De Nemours and Company

Cda Processing Limited Liability Company

Daniel Irwin Amey, Jr

William J Borland

Robert Joseph Bouchard

Syed Ismat Ullah Shah

Attiganal Narayanaswamy Sreeram

David Ross McGregor

Karl Hartmann Dietz

Sounak Banerji

Dennis John Bechis

Steven A Lipp

Jeffrey Paul Johnson

Arthur Miller

John Gerard Lavin

Saul Ferguson

Diptarka Majumdar

Deborah R Gravely

Henry Florentino Milgazo

Steven H White

Michael J Green

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Bendable circuit board for LED mounting and interconnection

A printed wiring board semiconductor package or PWB power core comprising singulated capacitors embedded on multiple layers of the printed wiring board semiconductor package wherein at least a part of each embedded capacitor lies within the die shadow and wherein the embedded, singulated capacitors comprise at least a first electrode and a second electrode. The first electrodes and second electrodes of the embedded singulated capacitors are interconnected to the Vcc (power) terminals and the Vss (ground) terminals respectively of a semiconductor device. The size of the embedded capacitors are varied to produce different self-resonant frequencies and their vertical placements within the PWB semiconductor package are used to control the inherent inductance of the capacitor-semiconductor electrical interconnections so that customized resonant frequencies of the embedded capacitors can be achieved with low impedance.

Device and method for reducing impedance

A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively and wherein the first and second electrode of the singulated capacitor is interconnected to the first and second electrode respectively of an external planar capacitor embedded within a printed wiring motherboard.

Power core devices and methods of making thereof

The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.

Making process test capacitors simultaneously with circuit capacitors that are to be embedded into a printed wiring board and firing the test capacitors to result in fired-on-foil test capacitors for the purpose of using the test capacitors as test substitutes for the embedded circuit capacitors to predict whether capacitance, dissipation factor or insulation resistance of the circuit capacitors will fall within acceptable specified ranges prior to and after embedment.

Methods for forming process test capacitors for testing embedded passives during embedment into a printed wiring board

The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein said planar capacitor laminate serves as a low inductance path to supply a charge to said at least one embedded singulated capacitor; and wherein said at least one embedded singulated capacitor is connected in parallel to at least one of the said planar capacitor laminates; and wherein said power core is interconnected to at least one signal layer.

Power core devices

Thick-film capacitors are formed on ceramic interconnect substrates having high capacitance densities and other desirable electrical and physical properties. The capacitor dielectrics are fired at high temperatures.

Thick film capacitors on ceramic interconnect substrates

Multilayer cathode backplate structures are provided for use with a field emitter in display panels. Processes for making the structures are also disclosed. The backplate structures are made of a plurality of electrodes separated by one or more patterned layers of a dielectric composition, each said patterned layer being formed by firing a thick film dielectric composition which has been patterned by diffusion patterning.

Field emitter cathode backplate structures for display panels

Patterned ion-bombarded graphite electron emitters are disclosed as well as processes for producing them. The electron emitters are produced by forming a layer of composite of graphite particles and glass on a substrate then bombarding the composite with an ion beam. The electron emitters are useful in field emitter cathode assemblies which are fabricated into flat panel displays.

Ion-bombarded graphite electron emitters

Patterned graphite electron emitters are disclosed. These field emitters find particular usefulness in field emitter cathodes and display panels. These graphite field emitters can be formed by screen printing a paste comprised of graphite and electrically insulating material (glass frit) in the desired patterned paste and bombarding the fire product with an ion beam.

Ion bombarded graphite electron emitters

Wire-coated graphite electron emitters are disclosed. These field emitters find particular usefulness in field emitter cathodes, display panels and lighting devices. These graphite field emitters can be formed by coating a paste comprised of graphite and glass frit onto the wire, firing the paste and bombarding the fired product with an ion beam.

Coated-wire ion bombarded graphite electron emitters

Patterned ion-bombarded carbon electron emitters and the processes for producing them. The electron emitters are produced by forming a layer of composite of carbon particles and glass on a substrate then bombarding the composite with an ion beam. The electron emitters are useful in field emitter cathode assemblies which are fabricated into flat panel displays.

Growing community of inventors

Durham, NC, United States of America

Daniel Irwin Amey, Jr