Intel Corporation

Daniel Grodensky

Israel Petronius

John Heck

David Neil Hutchison

Haisheng Rong

Jonathan K Doylend

David Arbel

Ankur Agrawal

Boping Xie

Kenneth Brown

Ronald L Spreitzer

Sanjeev Gupta

Jonathan Doylend

Eleanor Patricia Paras Rabadam

Sushrutha Gujjula

Konstantin Matyuch

Ron Friedman

Gal Dvoretzki

Sam Khalili

Nan Kong Ng

Stephen Keele

Guiyun Bai

Qifeng Wu

Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Silicon photonic systems for LIDAR applications

An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.

Low power, high resolution solid state LIDAR circuit having a modulator to modulate a bit sequence onto a carrier frequency of a received optical signal

Low power, high resolution solid state LIDAR circuit

Growing community of inventors

Haifa, Israel

Daniel Grodensky