Tel Nexx, Inc.

Mks Instruments, Inc.

Applied Science & Technology, Inc.

Daniel Goodman

Arthur Keigler

David G Guarnaccia

Freeman Fisher

William M Holber

Johannes Chiu

Ali Shajii

Siddharth P Nagarkatti

John A Smith

Michael Kishinevsky

Demetrius Papapanayiotou

Jonathan Hander

Timothy E Kalvaitis

William S McKinney, Jr

Stephen F Horne

Ilya Bystryak

Zhenqiu Liu

Gary D Alley

David Felsenthal

Stephen N Golovato

Jonathan Haynes

Andrzej Bortkiewicz

Terry Lee McElroy

Gary Boulet

Matthew R Jeffers

Techniques herein provide a workpiece handling and loading apparatus for loading, unloading, and handling relatively flexible and thin substrates for transport and electrochemical deposition. Such a system assists with workpiece holder exchange between a delivery cartridge or magazine, and a workpiece holder. Embodiments include a workpiece handler configured to provide an air cushion to a given workpiece, and maneuvering to a given workpiece holder that can edge clamp the workpiece.

Workpiece loader for a wet processing system

An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Electrochemical deposition apparatus and methods for controlling the chemistry therein

A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.

Seed layer deposition in microscale features

A substrate drying apparatus for drying a width of a surface of a substrate in a liquid. The substrate drying apparatus has a liquid tank containing the liquid. An injection nozzle is coupled to the liquid tank, the injection nozzle having a continuous knife edge injection surface across the width of the surface of the substrate. A drain is coupled to the injection nozzle, the drain having a continuous drain surface substantially parallel to the continuous knife edge injection surface and across the width of the surface of the substrate. The liquid forms a meniscus between the continuous drain surface and the width of the surface of the substrate. The injection nozzle directs a vapor at the meniscus.

Parallel single substrate marangoni module

A system for processing surfaces of substrates having a process module having a process module frame and a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A plurality of substrate holder assemblies, each having a number of substrate holders, each of which is removably coupled to the process module frame, each substrate holder configured to hold a substrate. The process module frame has alignment features aligning the substrate holders in the substrate holder assembly in repeatable alignment with respect to each of the process elements with each of the process elements located between the substrates. A loader module is configured to unload processed substrates from each of the substrate holder assemblies and load unprocessed substrates to each of the substrate holder assemblies. A transporter is configured to transport the substrate holder assemblies to and from the process module and the loader module.

Parallel single substrate processing system

A rotary chuck adapted to hold a substrate. The rotary chuck has a rotatable chuck portion and an edge grip having a movable grip member movably mounted to the rotatable chuck portion, the moveable grip member being substantially free moving so that rotation of the rotating chuck portion causes the moveable grip member to move in a plane substantially aligned with a surface of the substrate to engage the substrate in a engaged position. A resilient element is coupled to the moveable grip member, the resilient member biasing the grip member to a disengaged position.

Substrate holder

A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly having a holder frame and a number of substrate holders, each of which is coupled to the holder frame and is configured for holding a substrate so that each substrate holder holds a different substrate for transport as a unit with the substrate holder assembly to and from the process section. The substrate holder assembly and each substrate holder are removably coupled to the process section frame, and the substrate holders of the substrate holder assembly are movable relative to the holder frame and positionable in repeatable alignment with respect to a predetermined feature of the process section and independent of positioning of the holder frame with respect to the process section.

A substrate processing pallet can cool a substrate. A substrate processing pallet can include a base member; an interface pad attachable to the base member, the interface pad having substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate; and a surface of the base member having features for aligning a substrate on the interface pad. A substrate processing pallet can also include a base member; an interface pad attachable to the base member; an electrostatic chuck for gripping the substrate during processing; an energy storage system for storing energy to sustain the electrostatic chuck at sufficient charge to sustain grip the substrate during processing; and a conduit for transporting gas to a backside of the substrate to facilitate cooling of the substrate.

Substrate processing pallet with cooling

A substrate separation chuck which is adapted to separate a substrate from an adhering surface. The substrate separation chuck has a support adapted to support the adhering surface. An air bearing surface is adapted to support the substrate, the air bearing surface axially moveable relative to the support. The air bearing surface has a first position adjacent the substrate with the substrate coupled to the adhering surface. The air bearing surface is moveable from the first position to a second position separating the substrate from the adhering surface without contact between the substrate and the air bearing surface.

Substrate loader and unloader having an air bearing support

A substrate loader adapted to load and unload a substrate to and from a moveable holder having a seal. The substrate loader has a base and a holder support frame coupled to the base, the holder support frame adapted to repeatably position the moveable holder relative to a predetermined datum. The substrate transport is coupled to the base and having a substrate chuck and adapted to move and transport the substrate relative to the holder. The substrate transport is deterministically positioned relative to the predetermined datum and is adapted to move the substrate from a first position, with the substrate captured by the moveable holder, to a second position with the substrate disengaged from the holder and the seal, the substrate transport movement of the substrate from the first to the second position effecting disengagement from the holder and the seal substantially without contacting the substrate.

Substrate loader and unloader

A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.

Edge bevel removal apparatus and method

A system and method are provided for delivering power to a dynamic load. The system includes a power supply providing DC power having a substantially constant power open loop response, a power amplifier for converting the DC power to RF power, a sensor for measuring voltage, current and phase angle between voltage and current vectors associated with the RF power, an electrically controllable impedance matching system to modify the impedance of the power amplifier to at least a substantially matched impedance of a dynamic load, and a controller for controlling the electrically controllable impedance matching system. The system further includes a sensor calibration measuring module for determining power delivered by the power amplifier, an electronic matching system calibration module for determining power delivered to a dynamic load, and a power dissipation module for calculating power dissipated in the electrically controllable impedance matching system.

Radio frequency power delivery system

A substrate chuck includes a frame forming a support adapted to support an adhering surface thereon, and a Bernoulli chuck surface coupled to the frame and adapted to support the substrate. The Bernoulli chuck surface is axially moveable relative to the support between first and second positions. In the first position, the substrate is coupled to the adhering surface, and the substrate is separated from the adhering surface with movement of the Bernoulli chuck from the first position to the second position, without contact between the substrate and the Bernoulli chuck surface.

Substrate loader and unloader having a Bernoulli support

A substrate thermal processing system. The system has at least one substrate holding module having a housing configured for holding an isolated environment therein. A substrate heater is located in the housing and has a substrate heating surface. A substrate cooler is located in the housing and having a substrate cooling surface. A gas feed opening into the housing and feeding inert or reducing gas into the housing when the substrate is heated by the heating surface. A gas restrictor is within the housing restricting the fed gas between the substrate heating surface and a surrounding atmospheric region substantially surrounding the substrate heating surface in the housing and forming an aperture through which the fed gas communicates with the atmospheric region.

Growing community of inventors

Lexington, MA, United States of America

Daniel Goodman