Micron Technology Incorporated

Daniel G Scobee

Aswin Thiruvengadam

Aleksandr Semenuk

Sivagnanam Parthasarathy

Frederick Jensen

An apparatus includes a first thermoelectric component (TEC), a second TEC, a thermal transfer component disposed between the first TEC and the second TEC and a thermal conduction layer. The thermal conduction layer is coupled to the second TEC. The thermal conduction layer includes a planar area configured to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component.

Temperature control component for electronic systems wherein a thermal transfer component is tappered

A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

Standalone thermal chamber for a temperature control component

Thermal control component

A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

Thermal chamber for a thermal control component

A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

A temperature control component includes a TEC that includes a top surface and a bottom surface. A thermal conduction layer includes a top surface and a bottom surface. The top surface of the thermal conduction layer is coupled to the bottom surface of the TEC. The bottom surface of the thermal conduction layer includes a planar area. The planar area of the thermal conduction layer is to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer the thermal energy at the two or more electronic devices.

Temperature control component for electronic systems

Filter information including a first temperature level and a second temperature level associated with a test process to be executed on one or more memory components is determined. Information associated with the test process is distributed to a first test component including a first set of memory components and a first temperature control component and a second test component including a second set of memory components and a second temperature control component. First feedback information associated with execution of the test process by the first test component at the first temperature level established by the first temperature control component is received. Second feedback information associated with execution of the test process by the second test component at the second temperature level established by the second temperature control component is received. Based on at least one of the first feedback information or the second feedback information, a failure of the test process executed using at least one of the first temperature level or the second temperature level is determined.

Management of test resources to perform testing of memory components under different temperature conditions

A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

Test resources of a test platform that are performing a test of memory components are determined. An indication that a particular test resource of the test resources of the test platform has failed can be received. The particular test resource is failed while performing a portion of the test of memory components. A remaining portion of the test of memory components can be performed based on the indication that the particular test resource of the test platform has failed.

Performing a test of memory components with fault tolerance

Filter information associated with a test to be performed with one or more memory components is determined. A set of memory components matching the filter information may be reserved for use in the testing. Test execution information defining a set of test processes of the test is determined. A connection with a first test process may be established and used to receive feedback information associated with execution of the test process. Based on the feedback information, a failure of the first test process may be identified.

Management of test resources to perform reliability testing of memory components

An indication that a test resource of a test platform has failed can be received. The test resource can be associated with performing a portion of a test of memory components. A characteristic of the test resource that failed can be determined. Another test resource of the test platform can be identified based on the characteristic of the test resource that failed. The portion of the test of memory components can be performed based on the another test resource of the test platform.

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Daniel G Scobee