Juniper Networks, Inc.

Daniel Fairchild Farmer

Ashok Krishnamurthi

Richard W Singer

Henry K Sim

Mahesh Nagarajan

Ali Mira

Attila I Aranyosi

Travis S Mikjaniec

The disclosed apparatus may include (1) a plurality of vapor chambers that (A) are mounted to a plurality of individual power components that dissipate heat within a computing device and (B) absorb heat dissipated by the plurality of individual power components within the computing device and (2) at least one thermal coupling that (A) physically bridges the plurality of vapor chambers to one another within the computing device and (B) facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for improved heat spreading in heatsinks

The invention provides forced-air cooling to components mounted on circuit boards oriented in a side-to-side direction in a system. Airflow may enter and exit the system through the front and back (or vice-versa), rather than the sides of the system. In one embodiment, airflow entering the front of the system is re-directed in an upward direction, then split to form airflow branches traversing in a side-to-side direction. The airflow branches traverse across the surfaces of circuit boards, then are directed in an upward direction and out the back (or front) of the system. The airflow branches preferably move substantially the same volume of air per unit of time.

Apparatus and method for directing airflow in three dimensions to cool system components

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Mountain View, CA, United States of America

Daniel Fairchild Farmer