Xilinx, Inc.

Daniel Elftmann

Gamal Refai-Ahmed

Suresh Ramalingam

Brian Philofsky

Anthony Torza

Chip packages and electronic devices are provided that include a heat sink flexibly interfaced with a die for enhanced temperature control. In one example, a solid state electronic assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate and a heat sink mounted over the first IC die. The heat sink includes a thermally conductive plate and a first thermal carrier. The first thermal carrier has a first end mechanically fixed to the conductive plate. The first thermal carrier has a second end cantilevered from the conductive plate. The second end is in conductive contact with a top surface of the first IC die.

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San Jose, CA, United States of America

Daniel Elftmann