Rockwell Automation Technologies Incorporated

Daniel E Killian

Adam M Wrobel

Doug A Lostoski

Douglas Robert Bodmann

Ronald Edwin Schultz

Chandresh R Chaudhari

Kenwood H Hall

Sivaram Balasubramanian

Douglas Alan Lostoski

Kendal R Harris

Patrick C Herbert

Brian T Estanek

James Joseph Kay

Bret S Hildebran

Dale R Terdan

Sean P Overberger

Neal R Krejci

A first component of an industrial automation system includes an electrically erasable programmable read-only memory (EEPROM) storing data identifying the first component. The data identifying the first component is read from the EEPROM by a second component to which the first component is communicatively coupled to authenticate the first component. The first component lacks a processor and a microcontroller, and does not run firmware.

Systems and methods for authenticating industrial automation components

An I/O device includes an I/O base, at least two I/O modules supported on the I/O base, and a duplex terminal block assembly supported on the I/O base. The at least two I/O modules include a first I/O module and a second I/O module coupled to the duplex terminal block assembly in parallel. The duplex terminal block assembly can include connectors for connecting to a field device. The duplex terminal block assembly can include conductive structures for coupling the connectors with each of the first and second I/O modules. The duplex terminal block can be installed in a pair of ports in an I/O base to connect two I/O modules in parallel.

Removable terminal block assembly that permits an I/O base to operate in simplex mode or duplex mode

A modular I/O system for an industrial automation network includes a network adapter including first and second adapter modules, wherein each adapter module is configured for connection with an industrial network. The I/O system further includes a first I/O device with first and second I/O modules each configured for operative connection to a controlled system for input/output of data with respect to the controlled system. The I/O system further includes first and second independent backplane data networks that connect each of the first and second adapter modules to each of the first and second I/O modules. The network adapter includes first and second removable backplane network switches and the first I/O device includes third and fourth removable backplane network switches that establish the backplane networks. The backplane network switches can be Ethernet gigabit switches.

Distributed modular input/output (I/O) system with redundant ethernet backplane networks for improved fault tolerance

An I/O system having redundant removable and/or replaceable components. Each of the removable/replaceable components can be removed by displacement parallel to a common axis. An I/O device having an I/O base with a lock-out toggle to prevent installation of one or more I/O modules to the I/O base unless a ground screw has been secured to supporting structure.

Input/output system

An input/output (I/O) device for a distributed modular I/O system includes a base adapted to be connected to an associated support structure. A terminal block is connected to the base and includes a plurality of wiring connections adapted to be connected to field wiring of an associated controlled system. The I/O device further includes first and second I/O modules each including a plurality of removable single-channel I/O submodules that are each releasably connected to the base and each configured for a select I/O operation for input and output of data relative to the associated controlled system. One or more pairs of the single-channel I/O submodules can be configured to be redundant within or between the first and second I/O modules. Each of the single-channel I/O submodules is operatively connected to wiring connections of the terminal block through the base. The I/O device further includes first and second network switches connected to the base. The first and second network switches are adapted to be respectively connected to first and second backplane circuits. The I/O device further includes first and second system modules connected to the base and each respectively connected to both of the first and second network switches. The first and second system modules are also each respectively operatively connected to all of the removable single-channel I/O submodules of both of the first and second I/O modules such that the first and second system modules control communication of I/O data between the first and second network switches and the single-channel I/O submodules.

Distributed modular I/O device with configurable single-channel I/O submodules

An industrial automation controller module includes a main module and an energy storage module (ESM) releasably connected to the main module. The ESM includes a back-up electrical power source such as a battery or a capacitor that is electrically connected to processor circuitry of the main module when the ESM is physically connected to the main module. In case of interruption of operating power to the processor circuitry of the main module, the back-up power source of the ESM supplies back-up power to the main module to allow for completion of an emergency save operation to save data to non-volatile memory in the main module. If the ESM includes a capacitor back-up power source, it is charged by the main module and the capacitor charge is dissipated if the ESM is separated from the main module. In all cases, the ESM can include one or more configuration parameters stored therein that allow the main module to validate (or not) the ESM for the requirements of the main module, with respect to type of back-up power source, product code or model, capacity of back-up power source, and the like. The main module can also initiate periodic testing of the back-up power source of the ESM.

Energy storage module

An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

Thermal cooling of industrial electronic module by conductive structure

An electronic module and chassis/module installation are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

Growing community of inventors

Eastlake, OH, United States of America

Daniel E Killian