The Boeing Company

Mcdonnell Douglas Corporation

Daniel E Driemeyer

Kevin T Slattery

John Cleveland Waldrop, Iii

Jonathan David Embler

Ali Yousefiani

Victor Blakemore Slaughter

Stanley Allen Lawton

Elaine MacDonald

Nicholas B Segobiano

Laura Sullivan Riegel

Robert D Keeler, Jr

Jeremy Nicholas O'Hara

Justin L'Hote

James P Ledesma

John W Davis

Gerald W Wille

Grant G Gvozdich

An envelope portion of an airborne craft comprises a metallic outer wall and a metallic inner wall arranged interior to the outer wall. The outer and inner walls delimit an inter-wall volume configured to support a flow of coolant to cool the outer wall during atmospheric heating of the outer wall.

Active cooling of windward surface of craft

A passive non-ablating thermally protective structure body is disclosed. An improved-reliability heat pipe edge comprises a non-porous material formed into a wedge-shaped chamber, and a porous layer. The porous layer extends from interior surfaces of the non-porous material to provide capillary wicking.

Stay sharp, fail safe leading edge configuration for hypersonic and space access vehicles

Thermal barrier coated RF radomes and a method for making the same are provided. In an embodiment of the disclosure, there is provided a method for making a thermal barrier coated radio frequency (RF) radome. The method comprises providing a radio frequency (RF) radome. The method further comprises applying a thermal barrier coating having a dielectric constant less than about 2.0 onto a surface of the radome to form a thermal barrier coated RF radome. The thermal barrier coating reduces a structure temperature of the radome by greater than 300 degrees Fahrenheit to enhance thermo-mechanical properties and performance of the RF radome.

Thermal barrier coated RF radomes and method

Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Process of bonding copper and tungsten

Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.

Process of bonding a metal brush structure to a planar surface of a

Growing community of inventors

Manchester, MO, United States of America

Daniel E Driemeyer