Lpkf Laser & Electronics Ag

Lpkf Laser & Electronics Se

Plasma Innovations Gmbh

Daniel Dunker

Roman Ostholt

Norbert Ambrosius

Arne Schnoor

Malte Schulz-Ruhtenberg

Bernd Rösener

Sergej Schneider

Stephan Wenke

Tobias Jaus

Robin Alexander Krüger

Oktavia Ostermann

Michael Bisges

Kevin Hale

Aaron Michael Vogt

Moritz Doerge

Svenja Schudak

Moritz DÖRGE

Maik Bertke

A substrate made of glass includes an essentially dimensionally stable portion, one or more flexible portions, and one or more recesses on one side or which do not penetrate the substrate, and which is/are disposed in an outer surface of the substrate, so as to reduce a material thickness of the substrate in the flexible portion relative to an adjacent portion. The recess is formed in each case by a plurality of concave depressions that are defined by microstructures, a course of which determines a remaining material thickness of the substrate in the flexible portion. The depressions extend at least in portions into an area having a thickness parallel to the outer surface which on bending the substrate encloses a plane of a neutral axis between an extension zone and a compression zone of the substrate.

Substrate made of glass and method for the production thereof

A method for producing a display comprising a carrier substrate made of glass, the display having flexible, bendable and/or elastic properties in a predetermined region of the carrier substrate, includes introducing modifications into the carrier substrate within the region by laser radiation along a closed and/or linear contour and/or points. Within the region, a one flexible, bendable and/or elastic layer is applied. A side of the carrier substrate facing away from the layer is subjected to an etching attack, by which material removal from the carrier substrate takes place along the modifications along the contour and/or at the points of the region until recesses are produced that extend across or over a substantial part of a material thickness of the carrier substrate.

Method for producing a display having a carrier substrate, a carrier substrate produced according to said method, and a cover glass intended for a flexible display

The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.

Site-specific connecting of glass substrates

A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.

Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process

An optical component, in particular a passive component, for optical waveguiding, includes: optical waveguides formed in a carrier substrate as a waveguide pattern. The optical waveguides are formed in the carrier substrate by recesses by cutting out the optical waveguide. In an embodiment, the optical waveguide is connected to the carrier substrate by web-shaped supporting structures.

Optical component and method for the production thereof

A method for producing a technical mask includes: providing a technical mask including at least one plate-shaped substrate, the plate-shaped substrate being transparent to at least one laser wavelength; and producing at least one opening in the mask by laser-induced deep etching. In an embodiment, an etching attack takes place at least temporarily on one side during laser-induced deep etching.

Method for producing a technical mask

A method for machining, in particular for cutting an, in particular, planar substrate by laser-induced deep etching includes: moving laser radiation along a machining line; directing individual pulses onto the planar substrate at a spatial laser pulse distance (d); and subsequently removing an anisotropic material by etching at an etching rate (r) and an etching duration (t). Machining parameters are set according to a condition: 1&#x3e;d/(R*t)&#x3e;10.

Method for processing, in particular separating, a substrate by means of laser-induced deep reactive etching

A method for creating patterned coatings on a molded article includes providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area, applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property, and partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on an entire surface of the first area.

Growing community of inventors

Hannover, Germany

Daniel Dunker