Emc IP Holding Company LLC

Daniel Dufresne

Thomas Raymond Thibodeau

Patrick J Weiler

Ryan Cartland McDaniel

Matthew J Borsini

Antonio Fontes

Spero Tsefrekas

Matthew Mullins

Joseph Fenton

James L Pringle, Jr

Stephen Edward Strickland

Keith Clifford Johnson

Frank M Miyahira

A PCIe fabric is configured to couple a plurality of elements. The PCIe fabric includes a plurality of PCIe subfabrics. A primary master central processing system is configured to couple the plurality of PCIe subfabrics. A secondary master central processing system is configured to couple the plurality of PCIe subfabrics.

Fabric management system and method

A status monitoring system includes a signal generation subsystem configured to receive a plurality of binary status signals from a plurality of monitored subcomponents and encode the plurality of binary status signals to generate a status signal indicative of the status of the plurality of monitored subcomponents. One or more processing subsystems are configured to receive the status signal and control a controlled subcomponent based, at least in part, upon the status signal.

Status monitoring system and method

A user-configurable decoder circuit is associated with a controlled subcomponent and is configured to receive a cumulatively-encoded status signal and compare the cumulatively-encoded status signal to a user-definable threshold that defines a subcomponent policy for the controlled subcomponent.

A signal generation subsystem is configured to receive a plurality of status signals from a plurality of monitored subcomponents within a system being monitored and generate a cumulatively-encoded status signal based, at least in part, upon the plurality of binary status signals, which is indicative of the overall health of the system being monitored.

A PCIe fabric is configured to couple a plurality of elements. The PCIe fabric includes a plurality of PCIe subfabrics. A primary master central processing system is configured to couple the plurality of PCIe subfabrics and includes a primary master central processing unit.

A PCIe fabric is configured to couple a plurality of elements. The PCIe fabric includes a plurality of PCIe subfabrics. Each of the plurality of PCIe subfabrics includes a managing central processing unit and a PCIe fabric switch. One or more communication paths is configured to allow communication between the PCIe fabric switch included within each of the plurality of PCIe subfabrics.

A PCIe fabric is configured to couple a plurality of elements. The PCIe fabric includes a plurality of PCIe subfabrics including at least a first PCIe subfabric and a second PCIe subfabric. A primary master central processing system is configured to couple the plurality of PCIe subfabrics and includes a primary master central processing unit. The first PCIe subfabric is configured to enable multipath communication between a first element coupled to the first PCIe subfabric and a second element coupled to the second PCIe subfabric.

An adapter assembly includes an adapter board. A first connector assembly is coupled to the adapter board and is configured to releasably electrically couple the adapter board to a high-availability IT component. A second connector assembly is coupled to the adapter board and is configured to releasably couple the adapter board to a non-hot-swappable industry standard expansion card. The adapter board includes hot swap logic configured to enable the non-hot-swappable industry standard expansion card to function as a hot-swappable industry standard expansion card.

Hot-swappable adapter system for non-hot-swappable expansion cards

A signal generation circuit for producing an identification signal at a defined frequency. A frequency calibration circuit is electrically coupled to the signal generation circuit and is configured to set the defined frequency. The frequency calibration circuit includes a first calibration portion positioned on a first electrical subsystem and a second calibration portion positioned on a second electrical subsystem. An identification circuit is configured to process the identification signal to generate an identification result.

Identification system

An adapter assembly includes an adapter board. A first connector assembly is coupled to the adapter board and is configured to releasably electrically couple the adapter board to a high-availability IT component. A second connector assembly is coupled to the adapter board and is configured to releasably couple the adapter board to an industry standard expansion card. The adapter assembly is configured to be positioned within an enclosure of a hot swappable IT carrier assembly.

Adapter system

An IO subsystem, for use with an IT computing device, includes a cage assembly configured to releasably engage a chassis of the IT computing device and to receive a plurality of IO adapter cards. A midplane adapter assembly, positioned within the cage assembly, includes a first electrical connector system configured to engage a generic connector system included within the IT computing device and a second electrical connector system configured to engage the plurality of IO adapter cards. A coupling system is configured to releasably couple the cage assembly to the chassis of the IT computing device.

Rack-mountable IT device

A status monitoring system includes a signal generation subsystem configured to provide a status signal indicative of the status of one or more monitored subcomponents. A processing subsystem is associated with a controlled subcomponent and is configured to: assign a subcomponent policy to the controlled subcomponent, receive the status signal, compare the status signal to the subcomponent policy, and effectuate a procedure on the controlled subcomponent based, at least in part, upon the comparison of the status signal and the subcomponent policy.

A 1U rack-mountable computing device includes a storage component configured to include one or more storage devices. A second component is configured to be releasably coupleable to the storage component. A coupling system is configured to releasably couple the storage component to the second component.

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Salem, NH, United States of America

Daniel Dufresne