Sun Microsystems, Inc.

Bose Corporation

Daniel D Gonsalves

James M Carney

Robert S Antonuccio

Joseph M Spano

William A Izzicupo

Mathew J Palazola

Mark R Pugliese

David E Desilets

Joseph J Montagna

Thomas E Stewart

Timothy M Holland

Robert Antonnucio

Istvan Novak

Thomas George Andrikowich

Kenneth Kitlas

James F Testa

William Leslie Dailey

Richard Arthur Grebe

Matthew Neil Ruwe

Christopher E Chiodo

Leonardo Sandman

Daniel H Sargent

Robert Moffett

Lewis B Sheen

Jonathan A Colprit

Lance E Terry

Paul D Welch

James Piper Miglietta

Yvetta D Pols

Wigneswaran W Balasingham

Matthew Palazola

Kia-Pin A May

Mark Richard Pugliese

Various aspects include electronic devices with connection-enhancing, electrostatic discharge (ESD) protection features. In some examples, an electronic device includes: a housing; and a detent spring internal to the housing, where the detent spring (i) is positioned to contact a feature that is at least partially external to the housing and (ii) functions as an electrostatic discharge (ESD) sink.

Electronic device with electrostatic discharging detent spring

Various aspects include wearable devices with electrostatic discharge (ESD) mitigating features. In some examples, a control module is configured to connect to a wearable device, the control module including: a housing having at least one electrostatic discharge (ESD) ingress location, an electronic component in the housing, and a shield plate contained in the housing and connected to ground, the shield plate providing ESD protection for the electronic component.

Wearable device control module with electrostatic discharge (ESD) protection

Systems and methods are directed to a headphone having a headphone cap and a headphone housing. The headphone cap is mechanically coupled to a printed circuit board (PCB) which has a first electrical connector and a second electrical connector. The headphone housing is configured to be mechanically coupled with the headphone cap, and comprises a battery having a third electrical connector and a fourth electrical connector. The third electrical connector is configured to form a first electrical connection with the first electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. The fourth electrical connector is configured to form a second electrical connection with the second electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. In mechanically coupling the headphone housing to the headphone cap, the battery is configured to be horizontally adjacent to the PCB.

Systems and methods for unconstrained battery spring tab assemblies for in-ear headphone

A device for coupling to a connector on an ear cup of a headset includes a mating connector corresponding to the connector of the headset. The mating connector includes a crossover conductor coupled to a first and a second terminal within the mating connector. One or more accessory circuits is provided by the device, including a lamp configured to direct light onto a surface external to the device or a position detection circuit usable to adjust three-dimensional audio signals to account for the direction the user is looking.

Powered headset accessory devices

A bolster plate apparatus, used to secure a semiconductor device intermediate a printed circuit board and a heat sink apparatus, includes either an indentation or an open aperture into which a radio frequency absorptive material may be disposed. The absorptive material may be a ferrite material specifically selected to absorb frequencies in the range of the second to fourth harmonic of the processor clock signal frequency. The type of the ferrite material implanted in the bolster plate is selected to maximize the absorption of radio frequency energy, particularly that emitted at the pad vias on the underside of the printed circuit board, without affecting the signal integrity of the other pad connections. The shape of the cutout or aperture is also defined by the arrangement of RF emitting pads on the underside of the printed circuit board. The open aperture, without any absorptive material, effectively increases the distance between the source of the radio frequency energy and the metal body of the bolster plate, thereby reducing the amount of radio frequency energy absorbed by the bolster plate and the electromagnetic interference generated thereby. Also disclosed is a method for reducing the radiated emission from an adjacent semiconductor device by selectively removing pads from the undersurface of the PCB board to effectively reduce the sources of the radio frequency energy, and, therefore the amount of RF energy capacitively coupled with RF energy metal body of the bolster plate.

Method and apparatus for reducing capacitively coupled radio frequency energy between a semiconductor device and an adjacent metal structure

A method and apparatus relating to a support bracket ( ) enabling hot-swapping of component trays ( ) in component racks ( ) is disclosed. A bracket ( ) is provided for removably mounting a tray ( ) in a component rack ( ). The bracket ( ) has two guide channels ( ) extending substantially from a front end of the bracket ( ) through to a back end. The guide channel ( ) is adapted for sliding engagement with the component carrying tray ( ). In addition, there is at least one stop guide ( ) that projects from each of the front and back ends of the bracket ( ). This stop guide ( ) aids in positioning the bracket ( ) during installation. On a backside of the bracket ( ), there is a detent ( ) that projects outward. The detent ( ) serves as an aid in positioning and releasably holding the bracket ( ) in place during installation. The configuration of the bracket ( ) allows it to be used as either a bottom bracket ( ) or a top bracket ( ) for mounting a tray ( ), without any additional modifications.

Hot swap fan mounting support bracket

A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to a second chip. The heat pipe is arranged between the heat sink and plate member such that one end of the heat pipe attaches to the heat sink and the other end of the heat pipe attaches to the plate member. A system for cooling chips and method for dissipating heat generated by chips are also disclosed.

Chip cooling management

A test fixture which holds multiple circuit boards in an edge-to-edge configuration for testing includes a sliding interconnect mechanism which is located between the circuit boards under test. The interconnect mechanism includes an interconnect board on which are mounted pairs of inter-wired frame connectors which mate with the connectors on each of the printed circuit boards to be tested and electrically interconnect the boards. The interconnect mechanism includes guide pins on which the interconnect mechanism slides to accurately align the frame and board connectors and an actuating mechanism to move the interconnect mechanism into position to securely mate the aligned connectors. The actuating mechanism can also be reversed to unmate the connectors and release the boards under test after the tests are completed.

Test fixture with quick connect and release board interconnect mechanism

For a circuit board populated with numerous components having different heights, the need for numerous individual heatsinks to accommodate the circuit board's multilevel surface is eliminated. Instead, heat is transferred to a single integral heatsink via a thermal-conductive material (i.e., a thermal phase change material and/or a resilient gap filling material). A fastener secures the thermal-conductive material between the bottom portion of the heatsink and the multilevel surface, and compresses the thermal-conductive material therein, creating a thermal path sufficient to transfer heat from the multilevel surface to the heatsink so that the circuit board operates within specified design parameters.

Apparatus for dissipating heat from a circuit board having a multilevel surface

Computer system housing

The invention relates to a computer system and method thereof characterized by high airflow and low acoustic noise by separating the enclosure of the system into two sections, in which in one section cooling fans are arranged between power supply units and disk drives, the power supply units being located at the back of the section and the fans, as to the disk drives, serving as exhaust fans, and in the other section inlet fans are arranged to cool selected hardware electrical elements, such as CPU modules, PCI and graphics cards, wherein the placement of the inlet fans is selected to minimize pre-heated air and fan airflow paths are controlled and directed by an air dam to maximize the cooling effect, and noise damping material is employed in mounting the rack for the disk drives, the disk drives and fans and in forming the side walls of the enclosure.

Computer with high airflow and low acoustic noise

A PCI card is inserted through an I/O opening in a computer panel. On one edge of the card is a cover from one end of which projects a tab. A resilient gasket is attached to the panel to create a flexible EMC seal around the opening. Preferably the gasket is formed of tin-plated beryllium copper. The gasket has alternate staggered spring fingers oriented opposite to the direction of insertion of the PCI card. To retain the gasket the panel is formed with slots at either end and an outward struck projection at the middle. The gasket is formed with a tongue at either end to be inserted in one of the slots and a punched-out opening to receive the projection.

Modular EMC PCI card gasket

A computer housing or electronic apparatus frame (10) includes a compartment (12) that provides space for mounting a fan assembly (14) or similar component. The fan assembly (14) is mounted on a fan tray support (16), which is removably mountable within the computer housing (10) by means of the fan tray mounts (18). Fan tray mounts (18) are oriented facing one another so that side rails (22) of fan tray (16) are slidably received by the fan tray mounts (18). The fan tray mounts (18) further includes an elongated guide channel (31) that extends the length of the fan tray mount and is formed in the inside face (30) thereof. The fan tray mounts (18) also include a first, outwardly projecting stop (52) that is positioned inwardly from end wall (38) and a second, outwardly-projecting, resiliently-deflectable stop and latch lever (54) provided adjacent end wall (36). The first stop (52) and the second stop and latch (54) cooperate with tabs (84, 88) on the fan tray (16) to releasably latch the fan tray (16) in a predetermined position along the guide channel (31). The fan tray mounts (18) further include a pair of cantilevered spring arms (60, 62), which bias the fan tray (16) in a direction away from the guide channel (31) to minimize vibration transmission to the computer housing (10).

Fan tray guide and isolation mount and method

An apparatus for securing a conductor to a circuit board. The conductor is configured for being soldered to the circuit board through a first aperture in the board. The apparatus includes a conductor supporting portion having a second aperture therethrough. The conductor supporting portion is configured for coupling to the circuit board. The second aperture substantially aligns with the first aperture when the conductor supporting portion is coupled to the circuit board to permit the conductor to be inserted through both the first aperture and the second aperture. The apparatus includes a tab portion configured for coupling to the conductor supporting portion. A portion of the conductor is thus held substantially immobile between the conductor supporting portion and a first edge of the tab portion when the tab portion is coupled with the conductor supporting portion, thereby preventing the conductor from being broken at the portion of the conductor when the conductor is flexed.

Strain relief apparatus and methods therefor

The disclosed invention relates to the employment of a spacer element for mounting, aligning and spacing a computer chip relative to a PCB. The spacer element is formed and dimensioned to engage the chip in a manner to assure that the pins of the chip are properly aligned relative to openings in the PCB and to assure that the chip is centered and maintained parallel to the PCB and each of its pins maintained equal distance from the underneath side of the PCB during the wave soldering process for electrically connecting the chip and PCB.

Growing community of inventors

Hudson, NH, United States of America

Daniel D Gonsalves