Robert Boschgmbh

Forschungszentrum Karlsruhe Gmbh

Daniel Christoph Meisel

Burkhard Kuhlmann

Torsten Ohms

Johannes Classen

Joerg Hauer

Reinhard Neul

Rolf Scheben

Mirko Hattass

Axel Franke

Thorsten Balslink

Udo-Martin Gomez

Oliver Kohn

Kersten Kehr

Robert Sattler

Jens Frey

Heribert Weber

Christoph Schelling

Frank Fischer

Ando Feyh

Thomas Friedrich

Andrew Jonathan Doller

Benjamin Schmidt

Lars Tebje

Alexander Buhmann

Bernhard Gehl

Torsten Kramer

Martin Wegener

Patrick Wellner

Achim Trautmann

Yujie Zhang

Gokhan Hatipoglu

Christian Hoeppner

Andreas Fink

Andreas M Pietsch

Markus Heitz

Carsten Geckeler

Christian Rettig

Frank Freund

Carsten Raudzis

Martin Wrede

Martin Nezadal

Eugen Dietz

Sven Heider

Thomas Kathmann

Manuel Engesser

Iouri Mikliaev

Juergen Frasl

A device for a vehicle, which is attached to a vehicle, in particular, a commercial vehicle, and in which at least one or multiple surroundings sensor(s) is/are attached, a housing wall of the device being made from a material pervious to sensor radiation, and at least one housing wall of the device being made from a material absorbing sensor radiation.

Device for a vehicle

A sensor system is described as including at least two micromechanical inertial sensors, which are movably connected to a substrate, each inertial sensor including a functional layer, the functional layers of the two inertial sensors varying in thickness, and the two inertial sensors being situated next to one another on the substrate.

Sensor system including two inertial sensors

A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

Yaw-rate sensor

A yaw-rate sensor, having a substrate which has a main extension plane, for detecting a yaw rate about a first direction extending either parallel to the main extension plane or perpendicular to the main extension plane. The yaw-rate sensor has a drive device, a first Coriolis mass and a second Coriolis mass, the drive device being configured to drive at least one part of the first Coriolis mass and at least one part of the second Coriolis mass in a direction parallel to a drive direction extending perpendicular to the first direction.

Yaw-rate sensor with a compensating mass

Measures are provided which are used for stabilizing the substructure of the connecting areas of ASIC elements. These measures relate to ASIC elements including an ASIC substrate, into which electrical circuit functions are integrated, and including an ASIC layer structure on the ASIC substrate, which includes multiple wiring levels for the circuit functions, which are separated from one another by insulation layers and are interconnected via metallic plugs. At least one connecting area for placing wire bonds or for wafer bonding is implemented in at least one of the uppermost wiring levels. At least one chain of metallic plugs arranged vertically in a direct line is implemented in the ASIC layer structure below the connecting area, which extends from the uppermost wiring level up to the ASIC substrate or oxide trenches introduced therein.

ASIC element, in particular as a component of a vertically integrated hybrid component

A micromechanical inertial sensor includes an ASIC element having a processed front side, an MEMS element having a micromechanical sensor structure, and a cap wafer mounted above the micromechanical sensor structure, which sensor structure includes a seismic mass and extends over the entire thickness of the MEMS substrate. The MEMS element is mounted on the processed front side of the ASIC element above a standoff structure and is electrically connected to the ASIC element via through-contacts in the MEMS substrate and in adjacent supports of the standoff structure. A blind hole is formed in the MEMS substrate in the area of the seismic mass, which blind hole is filled with the same electrically conductive material as the through-contacts, the conductive material having a greater density than the MEMS substrate.

Micromechanical inertial sensor and method for manufacturing same

A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

Hybrid integrated component

A yaw rate sensor, including a substrate and a main extension plane, for detecting a yaw rate around a first direction in parallel to the main extension plane, a first Coriolis mass, and a second Coriolis mass, and a drive device configured to drive the first and second Coriolis masses in parallel to a drive direction perpendicular to the first direction, the first and second Coriolis masses, for a yaw rate around the first direction, experiencing a Coriolis acceleration in parallel to a detection direction, which is perpendicular to the drive and first directions, the first and second Coriolis masses having first/second partial areas and third/fourth partial areas, respectively. The first and third partial areas are farther from the axis of symmetry in parallel to the first direction, and the second and fourth partial areas are closer to the axis of symmetry in parallel to the first direction.

Yaw rate sensor

A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element.

Hybridly integrated component and method for the production thereof

The disclosure relates to a micromechanical rotary acceleration sensor including a substrate with at least one anchoring device and at least two flywheel masses. At least one of the flywheel masses is connected to at least one anchoring device by means of a coupling element. The at least one anchoring device is designed in such a manner that the at least two flywheel masses are elastically deflectable from a respective rest position about at least one axis of rotation. The at least two flywheel masses is designed in such a manner that they have different natural frequencies.

Micromechanical rotary acceleration sensor and method for detecting a rotary acceleration

A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

Piezoresistive micromechanical sensor component and corresponding measuring method

A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, where the movable substructures are excitable into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, where deflections of the Coriolis elements induced by a Coriolis force are detectable, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

A yaw-rate sensor for determining a Coriolis force includes a semiconductor substrate, a mass body mounted so it is movable over the semiconductor substrate, a drive unit for setting the mass body into an oscillating movement, and a detection unit for determining a deflection of the mass body which is caused by the Coriolis force. The detection unit includes a piezoresistive element, whose electrical resistance is a function of the deformation of the piezoresistive element.

Micromechanical system

Growing community of inventors

Vaihingen an der Enz, Germany

Daniel Christoph Meisel