Microsoft Technology Licensing, LLC

Daniel Chian

Julian Arlo Binder

Ruchi Jagdish Parikh

Vijayasekaran Boovaragavan

Jay Michael Fassett

Dongli Zeng

Eugene Lvovich Shoykhet

Rubén Caballero

James Chester Meador

Meera Radhakrishnan

Praveen Kumar Palacharla

David Christopher Perna

Elisa Naseem Haqq

Kevin The-Hung Pham

Ruchi Parikh

A computer implemented method includes accessing a first status of a first battery pack interface coupled to a load via a first load switch and accessing a second status of a second battery pack interface coupled to the load via a second load switch. The first status and the second status are compared and the first and second load switches are controlled based on the comparing to balance remaining capacities of the first and second battery packs.

Battery pack remaining charge balancing system

Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.

Soldering printed circuits using radiant heat

A machine implemented method includes alternately energizing multiple transmit coils in a first device, receiving indications of received signal strength at receive coils in a second device, selecting a first pair of coils including a first transmit coil and a first receive coil having the greatest received signal strength, and transferring energy from the first transmit coil to the first receive coil.

Receive and transmit coil pair selection

An electronic device includes a frame and a battery. The frame is configured to be worn on a user's body. The battery is supported by the frame and includes a first cell and a second cell in electrical parallel. The first cell has a first capacity and the second cell has a second capacity that is different from the first capacity.

Systems and methods of head-mounted devices with mixed capacity cells

An enhanced parallel protection circuit is provided. A system using separate battery packs in a parallel configuration is arranged with multiple protection circuit modules (PCMs). The PCMs are configured to detect fault conditions, such as over voltage, under voltage, excess current, etc. The PCMs can be configured to control associated switches and/or other components. When a fault condition is detected by an individual PCM, the individual PCM transitions to a fault state, and the PCM triggers an output causing one or more actions, e.g., causing a device to shut down or isolate one or more components. In addition, by the use of the techniques disclosed herein, the individual PCM can generate a control signal that causes other PCMs to transition to a fault state. The individual PCM can also receive a control signal from another PCM to cause the individual PCM to transition to a fault state.

Enhanced parallel protection circuit

Systems and methods for limiting battery discharge based on battery temperature are disclosed. In an example, a controller sets a current limit, using battery temperature, and provides corresponding current limits to a power management device and a system-on-chip (SOC). Upon battery discharge current exceeding the discharge current limit, the controller increases the discharge current limit, and provides updated current limits to the PM device and the SOC. Upon the battery temperature exceeding a battery pack maximum temperature, the controller issues a shutdown command to the PM device and the SOC.

Devices, systems, and methods for temperature based limiting of battery pack discharge

Techniques for enabling multi-pack and component connectivity detection are provided. In some configurations, individual PCMs can test the connectivity between components of a device without the need to operate the components. For example, PCMs configured in accordance with the present disclosure can test the connectivity between a motherboard, a display circuit, a camera, and a number of battery packs without the need to operate the motherboard, display circuit, camera, etc. In some configurations, conductors that are part of cables and connectors used to connect the components can be used to determine the state of one or more connections. When a signal that runs through the conductors meets one or more criteria, the PCMs of a device cause a predetermined delay prior to enabling one or more components. By testing the connectivity between components before each component transitions to an operational state, other problems caused by faulty connections can be mitigated.

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Los Altos, CA, United States of America

Daniel Chian