Intel Corporation

Daniel Chavez-Clemente

Joshua Heppner

Pramod Malatkar

Kyle Yazzie

Xiao Lu

Naida Duranovic

A substrate retention plate system for holding a substrate for processing in an electronic device manufacturing process is described. The retention plate system includes a top plate and a bottom plate to sandwich a flexible substrate. Additionally, the top plate includes a number of cams to stretch the flexible substrate across the bottom plate.

Stretching retention plate for electronic assemblies

A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.

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Chandler, AZ, United States of America

Daniel Chavez-Clemente