Apple Inc.

Daniel C Wagman

Eric Steven Jol

Hani Esmaeili

Ibuki Kamei

Christopher S Graham

Makiko K Brzezinski

Oliver Ross

Mahmoud R Amini

Darshan R Kasar

Lee M Panecki

Rico L Zorkendorfer

Brett W Degner

Albert John Golko

Christopher J Walton

Paul J Thompson

Benjamin J Kallman

Matthew D Hill

Jason S Sloey

Jennifer M Edwards

Benjamin A Cousins

Eric N Nyland

David A Hurrell

Stephen E Yao

Mattia Pascolini

Kurt R Stiehl

Harish Rajagopalan

Jahan C Minoo

Siwen Yong

Arun Dhyaneshwar Chawan

Simone Paulotto

Jiangfeng Wu

Bilgehan Avser

Zachary C Rich

Ching Yu John Tam

Daniel Max Strongwater

Jeffrey M Alves

Trent K Do

Robert Scritzky

Ihtesham H Chowdhury

Shannon X Yang

Chandrahas Aralaguppe Chandramohan

Xingqun Li

Marcus Albonico

Robert D Zupke

James L McPeak

Eric T SooHoo

Mani Razaghi Kashani

Derek J DiCarlo

Tony Chi Wang Ng

Di Zhao

Timothy Bryan Ogilvie

Chi Kin Ho

Carlos Ribas

Evan J Thompson

Nagendra Bage Jayaraj

Jiechen Wu

Roderick D Bacon

Surya Musunuri

Michael Benjamin Wittenberg

Jonathan Sarjeant Aase

Robert A Boyd

Craig Matthew Stanley

Rodney Andres Gomez Angulo

John B Ardisana, Ii

Edward S Huo

Phillip Qian

Todd K Moyer

James A Yurko

Daniel T McDonald

Warren Jones

Zechariah D Feinberg

David Garrido Lopez

Herng-Jeng Jou

Nagarajan Kalyanasundaram

Trent J Canales

Hoishun Li

Stefan A Kowalski

Forhad Hasnat

Raymund W M Kwok

Subramanian Ramalingam

Mikal Askarian Amiri

Arun R Varma

Wai Man Raymund Kwok

Joel C Yamasaki

Michael W Barnstead

Matthew E Lang

Soroush Akbarzadeh

Thomas W Yang

Richard J Blanco

Micah Lewis-Kraus

Ferdinand S Toting

David B Flamholz

Nathan A Van Nortwick

Jonathan C Lorman

Elisabeth Lang

Rodney A Gomez Angulo

An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

Dielectric resonator antenna modules

A mobile phone includes a housing structure, the housing structure defining a side surface of the mobile phone, a front cover coupled to the housing structure and defining a front surface of the mobile phone, a rear cover coupled to the housing structure and defining a rear surface of the mobile phone, a display positioned below the front cover, a first directional antenna defining a first radiation pattern extending through the front surface of the mobile phone, a second directional antenna defining a second radiation pattern extending through the rear surface of the mobile phone, and a third directional antenna defining a third radiation pattern extending through the side surface of the mobile phone.

Handheld electronic device

A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

Nanotwin copper components

High-speed connectors that save space in an electronic device, are simple to connect, and are readily manufactured. One example can provide a high-speed connector having high-speed connections. The high-speed connections can be integrated with low-speed connections in a board-to-board structure to save space in an electronic device. An example can provide high-speed connections that are simple to connect. The board-to-board structure can include a board-to-board plug, where each high-speed connection includes a high-speed contact having a lateral portion. The lateral portion can include right-angle tabs to guide a central conductor of a coaxial cable. The central conductor of each coaxial cable can be soldered to a corresponding lateral portion. Ground contacts for the board-to-board plug can include crimping portions to connect to an outer shield of each coaxial cable. These high-speed connectors can be readily manufactured by utilizing stamped contacts and molded housings.

Integrated high frequency connector

A case a portable listening device. The case includes a housing having an interior space to receive the portable listening device; a lid attached to the housing; a rechargeable battery and first and second wireless power receiving elements configured to receive electric charge from a wireless power transmitter during a charging event. The case further includes switching circuitry that is configured to disable one of the first or second wireless power receiving elements during a charging event when the disabled element is receiving power less efficiently than the other element.

Charging case for wireless earphones

A waveguide structure to allow device to determine its orientation are disclosed. The waveguide may be formed of a dielectric core and a cladding. The dielectric core may be formed of a solid dielectric material that conducts radio waves at millimeter wave frequencies and above. The cladding may encapsulate the core, and may include at least two conductive portions. Each conductive portion may be disposed around less than the entire core. The conductive portions allow electrical signals to flow between two devices to determine an orientation of the waveguide.

Conductive cladding for waveguides

A voltage of a first pin that is one of several pins of an external connector of a system is measured, while the first pin is un-driven except for being pulled to ground through a first resistance, and a second pin of the external connector is being used as a power supply rail of the system. The measured voltage is compared to a short circuit threshold and in response to that threshold being exceeded, the power supply voltage on the second pin is reduced. In such an embodiment, no test stimulus needs to be applied to any of the pins of the external connector. Other embodiments are also described and claimed.

Corrosion mitigation for an external connector of an electronic device

Inductively chargeable earbud case

This application relates to magnetically actuated electrical connectors. The electrical connectors includes movable magnetic elements that move in response to an externally applied magnetic field. In some embodiments, the electrical connectors includes recessed contacts that move from a recessed position to an engaged position in response to an externally applied magnetic field associated with an electronic device to which the connector is designed to be coupled. In some embodiments, the external magnetic field has a particular polarity pattern configured to draw contacts associated with a matching polarity pattern out of the recessed position.

Magnetic surface contacts

An electronic device comprising a device enclosure having an exterior surface; a contact area positioned at the exterior surface and having first and second ends, the contact area having a plurality of contacts arranged between the first and second ends and substantially flush with the exterior surface; and an alignment feature within the enclosure comprising first and second magnets positioned on opposing sides of the contact area, the first magnet positioned adjacent to the first end of the contact area and the second magnet positioned adjacent to the second end of the contact area.

Electronic device with contacts flush with housing

Methods and apparatuses for improved efficiency of power transfer across an inductive charging interface by selectively activating, deactivating, or modifying one or more of a plurality of transmit coils associated with an inductive power transmitter are disclosed.

Multi-coil induction

Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.

Low-profile power and data contacts

Growing community of inventors

Scotts Valley, CA, United States of America

Daniel C Wagman