Laird Technologies Gmbh

Daniel C Green

Gerald Robert English

James E Kline

Paul W Crotty, Jr

According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies. Exemplary embodiments are also disclosed of shielding assemblies including such frames. In exemplary embodiments, a frame for a board level shield (BLS) may include at least one finger or tab (broadly, a portion or contact) configured to fill, cover, or close off a gap or void defined by a cover's sidewalls to thereby inhibit or prevent EMI leakage through the gap or void.

Frames for shielding assemblies and shielding assemblies including the same

A grounding strip is described configured to be installed along an edge portion of a substrate for establishing electrical grounding contact between the substrates and a card guide. The grounding strip includes integral grounding members. Each grounding member includes opposing sidewall portions defining a channel configured to receive the edge portion of the substrate therein. The sidewall portions of each grounding member are configured to engage the substrate when the edge portion of the substrate is received in the channel to help retain the edge portion of the substrate in the channel. Each grounding member also includes a contact element disposed generally over the channel. The contact element is integrally formed with at least one of the opposing sidewall portions of the grounding member and is configured to establish electrical contact with the card guide when the grounding strip is installed to the substrate and located in the card guide.

Card guide grounding strips

According to various aspects of the present disclosure, exemplary embodiments are provided of shielding apparatus that are suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. The shielding apparatus may have partially drawn and partially formed corner sections for improved rigidity. In one exemplary embodiment, a shielding apparatus generally includes side walls configured to be disposed generally about one or more electrical components on a substrate. Corner sections are integrally formed with the side walls. Each corner section has a drawn portion integrally connecting a corresponding pair of side walls, and a lower portion located generally below the drawn portion and generally between side edge portions of the corresponding pair of side walls.

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Kunkletown, PA, United States of America

Daniel C Green