Ev Group Gmbh

Ev Group E. Thallner Gmbh

Ev Group W. Thallner Gmbh

Daniel Burgstaller

Jürgen Burggraf

Stefan Pargfrieder

Friedrich Paul Lindner

Jurgen Burggraf

Herbert Tiefenböck

Werner Thallner

Paul Lindner

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

Bendable carrier mount, device and method for releasing a carrier substrate

A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Device for aligning and pre-fixing a wafer

This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface Fwhich penetrates the mounting surface solely in an outer ring surface for effecting a fluid flow which produces suctions on the substrate.

Holding device for holding a patterned wafer

A workholding fixture for holding flat semiconductor substrates with

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Neuhofen/Innkreis, Austria

Daniel Burgstaller