Kulicke and Soffa Industries, Inc.

Siemens Schweiz Ag

Daniel Buergi

Peter Ellenberger

Fabian Schneider

Mathias Moser

Alexander Holzer

Eirini Kakkava

Urban Ernst

Andreas Marte

A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.

Die bonding systems, and methods of using the same

Growing community of inventors

Berg, Switzerland

Daniel Buergi