Phononic Devices, Inc.

Lenovo (singapore) Pte. Ltd.

Phononic, Inc.

Daniel Barus

Marshall S Stanley

Jesse W Edwards

Robert Joseph Therrien

Ricardo E Rodriguez

Abhishek Yadav

Robert M Piper

Robert B Allen

Daniel Swann

Mattias K-o Olsson

Paul Brian McCain

Donald G Polak

Justin W English

Systems and methods for mitigating heat rejection limitations of a thermoelectric module are disclosed. In some embodiments, a method of operating a thermoelectric module includes providing a first amount of power to the thermoelectric module and determining that a temperature of a hot side of the thermoelectric module is above a first threshold. The method also includes, in response to determining that the temperature of the hot side is above the first threshold, providing a second amount of power to the thermoelectric module that is less than the first amount of power. The method also includes determining that the temperature of the hot side of the thermoelectric module is below a second threshold and providing a third amount of power to the thermoelectric module. In some embodiments, this mitigates heat rejection limitations of the thermoelectric module, especially when the hot side of the thermoelectric module is passively cooled.

Systems and methods for mitigating heat rejection limitations of a thermoelectric module

Multi-channel universal serial bus (USB) to subrate channel systems and methods are disclosed. According to an aspect, a system includes a USB interface configured to communicatively connect to a computing device. The system may also include a multi-channel interface configured to communicatively connect to multiple subrate channels. Further, the system may include a controller configured to communicatively connect the subrate channels with the computing device via the USB interface. The controller may also be configured to communicate, to the computing device, connection specifications for the subrate channels.

Multi-channel universal serial bus (USB) to subrate channel systems

Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Hybrid fan assembly and active heating pumping system

Systems and methods for operating a thermoelectric module to increase efficiency are disclosed. In some embodiments, a method of operating a thermoelectric module includes determining a first amount of power that would maximize a coefficient of performance of the thermoelectric module based on one or more system parameters and providing the first amount of power to the thermoelectric module. The method also includes determining that at least one of the one or more system parameters has changed, determining a second amount of power that would maximize the coefficient of performance of the thermoelectric module based on the one or more system parameters, and providing the second amount of power to the thermoelectric module. In some embodiments, adjusting the amount of power provided based on the one or more system parameters increases the efficiency of the thermoelectric module.

Systems and methods for operating a thermoelectric module to increase efficiency

Systems and methods are disclosed herein relating to an Alternating Current-Direct Current (AC-DC) power conversion system for supplying power to one or more Thermoelectric Coolers (TECs). In some embodiments, a system comprises one or more TECs and an AC-DC power conversion system configured to supply power to the one or more TECs for a high efficiency mode of operation and a high heat pumping mode of operation. The AC-DC power conversion system comprises a first AC-DC power converter configured to convert an AC input to a DC output at a first output power level for the high efficiency mode of operation of the one or more TECs. The AC-DC power conversion system further comprises a second AC-DC power converter configured to convert the AC input to a DC output at a second output power level for the high heat pumping mode of operation of the one or more TECs.

High-efficiency power conversion architecture for driving a thermoelectric cooler in energy conscious applications

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Raleigh, NC, United States of America

Daniel Barus