Chevron Phillips Chemical Company LP

Daniel B Knorr

Tin-Tack Peter Cheung

Gyanesh P Khare

Daniel M Hasenberg

Dennis L Holtermann

Scott H Brown

Joseph Bergmeister, Iii

Robert L Hise

Christopher D Blessing

Geoffrey E Scanlon

David J Glova

Joseph Bergmeister

Joseph Bergmeister Iii

A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer.

Method of treating a surface to protect the same

A radial flow reactor comprising a floating top cover plate assembly. A method of operating a radial flow reactor comprising floating a top cover plate assembly within the reactor.

Floating top cover plate assembly for radial flow reactors

Growing community of inventors

Humble, TX, United States of America

Daniel B Knorr