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Daniel Arie Leder

Duncan George Elliott

Raymond Jit-Hung Sung

John Conrad Koob

Tyler Lee Brandon

The design methods described enable three-dimensional integrated circuit systems in which all of the dies, in a vertically bonded stack of dies, are identical. Only one mask set and wafer type is required since a single circuit design is produced for one die in the stack and reused for all the dies with little or no modification. The system scales directly as the level of stacking is increased while incurring no extra design effort, beyond that required for the initial design.

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Spruce Grove, AB, Canada

Daniel Arie Leder