Delphi Technologies, Inc.

Other

Daniel A Lawlyes

Joseph M Ratell

Steven T Reyburn

Anthony Raschilla

Paul J Pitzer

Duane Zedric Collins

David A Laudick

Roy Alan Visser

James Ira Moyer

Jay Leonard Kelly

David P Buehler

Perry L Martinson

An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.

Electronic enclosure with continuous ground contact surface

A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed. An encapsulating material, preferably an epoxy material, is transferred or injected into the mold cavity to fill space between the respective surfaces of the electronic component and the circuit board and then cured to encapsulate the solder bumps that have been reflowed. An optional integrated heat sink for the electronic component may be used when practicing the method of the invention to make an electronic assembly.

Method of making an electronic assembly

A device for enclosing electronics and providing an electrical connection to the enclosed electronics is provided. The device includes a housing having alignment and barrier features, and a circuit board having alignment features and plated through-holes. The circuit board is coupled to the housing such that the alignment features of the circuit board and housing are aligned, and such that the barrier features of the housing are located adjacent the plated through-holes. The device further includes an epoxy material that at least partially coats the surfaces of the housing and circuit board. The barrier features separate the plated through-holes from the epoxy material, such that the epoxy material is not in contact with the interior surface of the plated through-holes. A method for enclosing electronics and providing an electrical connection to the enclosed electronics is also provided.

Electronics enclosure and method of fabricating an electronics enclosure

A method and assembly () for conducting heat from a semiconductor device, such as a power flip chip (). The assembly () is generally constructed to dissipate heat from the flip chip () when mounted to a flexible or rigid substrate (). Heat is conducted from the flip chip () through upper and lower pedestals () each of which includes a pliable pre-cured silicone adhesive pad (). The pre-cured silicon adhesive pads () promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips (). The housing portions () form a housing () when assembled, with each housing portion () including a configured edge () that controls the travel of the pedestals () toward each other, to thereby limit the pressure exerted on the flip chip () disposed therebetween. Silicone adhesive can be applied between the edges () to hold the housing portions () together.

Relaxed tolerance flip chip assembly

A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.

Heat sink with integrated electronics

A method and assembly ( ) for conducting heat from a semiconductor device, such as a power flip chip ( ). The assembly ( ) is generally constructed to dissipate heat from the flip chip ( ) when mounted to a flexible or rigid substrate ( ). Heat is conducted from the flip chip ( ) through upper and lower pedestals ( ) each of which includes a pliable pre-cured silicone adhesive pad ( ). The pre-cured silicon adhesive pads ( ) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips ( ). The housing portions ( ) form a housing ( ) when assembled, with each housing portion ( ) including a configured edge ( ) that controls the travel of the pedestals ( ) toward each other, to thereby limit the pressure exerted on the flip chip ( ) disposed therebetween. Silicone adhesive can be applied between the edges ( ) to hold the housing portions ( ) together.

The present invention discloses an apparatus for golf putting practice wherein the present invention is an insert having at least one regulation size golf hole disposed therein wherein the insert is complementarily sized and shaped to be inserted into the outlet opening of a conventional heating and ventilation air conditioning (HVAC) system as might occur in the floor of a home or office building replacing a standard vent register. The insert is sized to be removably secured internal of the HVAC outlet so that it can be easily inserted and removed therefrom.

Apparatus for golf putting practice

A high density wirebond connector assembly ( ), is provided including an enclosure ( ), a circuit board ( ), a high density connector ( ), a connector housing ( ), and a plurality of pin contacts ( ). Every two rows of pin contacts ( ) merge onto a single shelf ( ) to provide a high density contact surface ( ). The circuit board ( ) is comprised of a plurality of laminate layers ( ) and rows of wirebond pads ( ) positioned on the laminate layers ( ). A plurality of wirebonds ( ) run between individual pin contacts ( ) and individual wirebond pads ( ). By creating a high density contact surface ( ) in combination with decreasing the distance between the wirebond pads ( ) and the pin contacts ( ), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly ( ) is provided.

High density wirebond connector assembly

An electronics assembly is provided, including a base element and a cover element The base element includes a perimeter mating groove and the cover element including a perimeter tongue element A plurality of crush ribs are formed into the perimeter tongue element such that when the perimeter tongue element is positioned within the perimeter mating groove during assembly, the plurality of crush ribs establish conductive contact between the base element and the cover element

Electronic enclosure with improved EMC performance

A pressure sensor connector ( ) for use with a pressure sensor element ( ) that includes a plurality of pressure sensor terminals ( ). The pressure sensor connector ( ) includes a housing ( ), a plurality of connector terminals ( ) and a flexible circuit ( ). A plurality of electrical pathways ( ), formed on the flexible circuit ( ), connect each of the plurality of connector terminals ( ) to a corresponding pressure sensor terminal ( ).

Pressure sensor connector

A pressure sensor connector ( ) for use with a pressure sensor element ( ) that includes a plurality of pressure sensor terminals ( ). The pressure sensor connector ( ) includes a cap ( ), a plurality of connector terminals ( ) and a frame element ( ). A plurality of contacts ( ), included in the frame element ( ), connect each of the plurality of connector terminals ( ) to a corresponding pressure sensor terminal ( ).

A smart actuator (,), includes a mounting base (,), a solenoid element (,), and a pressure sensor element (,). The solenoid element (,) and the pressure sensor element (,) are in electrical communication with a remote control element (,) through a wire harness (,). The remote control element (,) sends a signal to the solenoid element (,) to adjust hydraulic fluid pressure. The pressure sensor (,) reports back to the remote control element (,) the value of hydraulic fluid pressure such that a closed-loop system in formed where correct hydraulic fluid pressure is rapidly and accurately attained.

Apparatus for controlling hydraulic fluid pressure

A high density wirebond connector assembly (,), including an enclosure (,), a circuit board (,), a high density connector (,), a connector housing (,), and a plurality of nail contacts (,). The circuit board (,) is comprised of a plurality of laminate layers (,) and rows of wirebond pads (,) positioned on the laminate layers (,). A plurality of wirebonds (,) run between individual nail contacts (,) and individual wirebond pads (,). By increasing the density of the high density connector (,), and decreasing the distance between the wirebond pads (,) and the nail contacts (,), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly (,) is provided.

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Kokomo, IN, United States of America

Daniel A Lawlyes